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Journal description
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Details for article 8 of 22 found articles
| Title: |
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates:I. Effects of Loading and Processing Conditions |
| Author: |
Huang, Z. Kumar, P. Dutta, I. Pang, J.H.L. Sidhu, R. Renavikar, M. Mahajan, R. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 41 (2011) nr. 2 pages 375-389 |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 22 found articles
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