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                             27 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Atomic Mobilities in the Ag-Cu-Sn Face-Centered Cubic Lattice Gierlotka, W.
2012
41 12 p. 3359-3367
artikel
2 Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation Li, X. N.
2012
41 12 p. 3447-3452
artikel
3 Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications Ho, C.E.
2012
41 12 p. 3276-3283
artikel
4 Effect of a Nanodimensional Polyethylenimine Layer on Current–Voltage Characteristics of Hybrid Structures Based on Single-Crystal Silicon Malyar, I.V.
2012
41 12 p. 3427-3435
artikel
5 Effect of Inverse Doped Surface Layer in Schottky Barrier Modification: A Numerical Study Chand, Subhash
2012
41 12 p. 3387-3392
artikel
6 Effects of Bi2Se3 Nanoparticle Inclusions on the Microstructure and Thermoelectric Properties of Bi2Te3-Based Nanocomposites Kim, HeeJin
2012
41 12 p. 3411-3416
artikel
7 Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au Surface Finish During the Reflow Process Chung, Bo-Mook
2012
41 12 p. 3348-3358
artikel
8 Electrical and Optical Properties of p-Type Li,Cu-Codoped NiO Thin Films Chen, Xinman
2012
41 12 p. 3382-3386
artikel
9 Electrode Materials for Ge2Sb2Te5-Based Memristors Wang, Q.
2012
41 12 p. 3417-3422
artikel
10 Electromigration Study on Sn(Cu) Solder/Ni(P) Joint Interfaces Wu, S.H.
2012
41 12 p. 3342-3347
artikel
11 Evaluation of Diffusion Barrier Between Pure Sn and Te Ko, Chang-Yen
2012
41 12 p. 3320-3324
artikel
12 Fabrication of CIGS Films by Electrodeposition Method for Photovoltaic Cells Lee, Hyunju
2012
41 12 p. 3375-3381
artikel
13 Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads Ho, C.E.
2012
41 12 p. 3266-3275
artikel
14 Highly Textured Mn15Si26 Film Obtained by High-Temperature Treatment Zirmi, R.
2012
41 12 p. 3423-3426
artikel
15 Improved Optoelectronic Properties of Rapid Thermally Annealed Dilute Nitride GaInNAs Photodetectors Tan, S.L.
2012
41 12 p. 3393-3401
artikel
16 Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates Hu, Tien-Chen
2012
41 12 p. 3309-3319
artikel
17 Interfacial Reactions and Mechanical Properties of Bi-x wt.%Sn/Cu Joints (x = 2, 5, 10) Wang, Jin-Yi
2012
41 12 p. 3303-3308
artikel
18 Interfacial Reactions Between Diffusion Barriers and Thermoelectric Materials Under Current Stressing Lo, Li-Chen
2012
41 12 p. 3325-3330
artikel
19 Interfacial Reactions Between Sn-Zn Alloys and Au Substrate Yen, Yee-wen
2012
41 12 p. 3284-3291
artikel
20 Kinetics of Solid-State Reactive Diffusion in the (Ni-Cr)/Sn System Motojima, K.
2012
41 12 p. 3292-3302
artikel
21 Liquid-State Interfacial Reactions of Sn-Zn/Co Couples at 250°C Wang, Chao-hong
2012
41 12 p. 3259-3265
artikel
22 Microstructural Investigation of Interfacial Features in Al Wire Bonds Khatibi, G.
2012
41 12 p. 3436-3446
artikel
23 NiSn4 Formation in As-Soldered Ni-Sn and ENIG-Sn Couples Belyakov, S. A.
2012
41 12 p. 3331-3341
artikel
24 Rediscovery of the Role of the i-Layer in n-ZnO/SiO2/p-GaN Through Observations from Both the ZnO and GaN Sides Liu, Yuanda
2012
41 12 p. 3453-3456
artikel
25 Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates Hsiao, Yu-Hsiang
2012
41 12 p. 3368-3374
artikel
26 Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations Xie, Huxiao
2012
41 12 p. 3249-3258
artikel
27 Thermoelectric Properties of Heavy Rare Earth Filled Skutterudites DyyFexCo4−xSb12 Luo, Tao
2012
41 12 p. 3402-3410
artikel
                             27 gevonden resultaten
 
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