| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Analysis of Dislocation Density in Pb(1−x)SnxSe Grown on ZnTe/Si by MBE
|
Taylor, P. J.
|
|
2009
|
38 |
11 |
p. 2343-2347
|
article
|
| 2 |
Controlled Growth of Non-Uniform Arsenic Profiles in Silicon Reduced-Pressure Chemical Vapor Deposition Epitaxial Layers
|
Popadić, M.
|
|
2009
|
38 |
11 |
p. 2323-2328
|
article
|
| 3 |
Copper-Silver Alloy for Advanced Barrierless Metallization
|
Lin, C. H.
|
|
2009
|
38 |
11 |
p. 2212-2221
|
article
|
| 4 |
Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions
|
Yen, Yee-Wen
|
|
2009
|
38 |
11 |
p. 2257-2263
|
article
|
| 5 |
Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller
|
Cheng, Yung-Chi
|
|
2009
|
38 |
11 |
p. 2368-2375
|
article
|
| 6 |
Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process
|
Huang, Kuan-Chih
|
|
2009
|
38 |
11 |
p. 2270-2274
|
article
|
| 7 |
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints
|
Du, X. N.
|
|
2009
|
38 |
11 |
p. 2398-2404
|
article
|
| 8 |
Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition
|
Luo, Wei-Hsiang
|
|
2009
|
38 |
11 |
p. 2264-2269
|
article
|
| 9 |
Fifteen-Nanometer Ru Diffusion Barrier on NiSi/Si for a sub-45 nm Cu Contact Plug
|
Lin, Jia-Huei
|
|
2009
|
38 |
11 |
p. 2251-2256
|
article
|
| 10 |
Foreword
|
Chen, Chih-ming
|
|
2009
|
38 |
11 |
p. 2211
|
article
|
| 11 |
Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates
|
Chang, C. C.
|
|
2009
|
38 |
11 |
p. 2234-2241
|
article
|
| 12 |
Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films
|
Mei, Yunhui
|
|
2009
|
38 |
11 |
p. 2415-2426
|
article
|
| 13 |
Impact of Reaction Shrinkage on Stress in Semiconductor Packages
|
Mengel, Manfred
|
|
2009
|
38 |
11 |
p. 2362-2367
|
article
|
| 14 |
In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays
|
Wu, Albert T.
|
|
2009
|
38 |
11 |
p. 2308-2313
|
article
|
| 15 |
Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging
|
Cho, Moon Gi
|
|
2009
|
38 |
11 |
p. 2242-2250
|
article
|
| 16 |
Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates
|
Liou, Wei-kai
|
|
2009
|
38 |
11 |
p. 2222-2227
|
article
|
| 17 |
Investigation of the Interfaces in Ni-FUSI/Hf-Based/Si and Ni-FUSI/SiO2/Si Stacks by Physical and Electrical Characterization Techniques
|
Tan, S. Y.
|
|
2009
|
38 |
11 |
p. 2314-2322
|
article
|
| 18 |
N Doping and Al-N Co-doping in Sol–Gel ZnO Films: Studies of Their Structural, Electrical, Optical, and Photoconductive Properties
|
Dutta, M.
|
|
2009
|
38 |
11 |
p. 2335-2342
|
article
|
| 19 |
Ohmic Contact to High-Aluminum-Content AlGaN Epilayers
|
Srivastava, Surendra
|
|
2009
|
38 |
11 |
p. 2348-2352
|
article
|
| 20 |
Performance Comparison of Top- and Bottom-emitting Long Wave Infrared Light Emitting Diode Devices
|
Das, Naresh C.
|
|
2009
|
38 |
11 |
p. 2329-2334
|
article
|
| 21 |
Primary Creep in Sn-3.8Ag-0.7Cu Solder, Part II: Constitutive Creep Model Development and Finite Element Analysis
|
Shirley, D. R.
|
|
2009
|
38 |
11 |
p. 2388-2397
|
article
|
| 22 |
Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction
|
Shirley, D. R.
|
|
2009
|
38 |
11 |
p. 2376-2387
|
article
|
| 23 |
Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps
|
Lim, Gi-Tae
|
|
2009
|
38 |
11 |
p. 2228-2233
|
article
|
| 24 |
The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections
|
Schmetterer, C.
|
|
2009
|
38 |
11 |
p. 2275-2300
|
article
|
| 25 |
Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition
|
Liu, Meng
|
|
2009
|
38 |
11 |
p. 2353-2361
|
article
|
| 26 |
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
|
Garcia, Leonardo R.
|
|
2009
|
38 |
11 |
p. 2405-2414
|
article
|
| 27 |
Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate
|
Jung, Inyu
|
|
2009
|
38 |
11 |
p. 2301-2307
|
article
|
Journal description