| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates
|
Gao, Feng
|
|
2007
|
37 |
1 |
p. 45-50
|
artikel
|
| 2 |
Can Whiskers Grow on Bulk Lead-Free Solder?
|
Nychka, John A.
|
|
2007
|
37 |
1 |
p. 90-95
|
artikel
|
| 3 |
Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates
|
Kang, Han-Byul
|
|
2007
|
37 |
1 |
p. 84-89
|
artikel
|
| 4 |
Demonstration and Characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging
|
Jo, Yun-Hwan
|
|
2007
|
37 |
1 |
p. 110-117
|
artikel
|
| 5 |
Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging
|
Hong, K.K.
|
|
2007
|
37 |
1 |
p. 61-72
|
artikel
|
| 6 |
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
|
Lin, Y.L.
|
|
2007
|
37 |
1 |
p. 96-101
|
artikel
|
| 7 |
Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature
|
Xu, Dong-Xia
|
|
2007
|
37 |
1 |
p. 125-133
|
artikel
|
| 8 |
Foreword
|
Guo, Fu
|
|
2007
|
37 |
1 |
p. 1
|
artikel
|
| 9 |
Interfacial Reactions in the Sn-Bi/Te Couples
|
Chiu, Chen-nan
|
|
2007
|
37 |
1 |
p. 40-44
|
artikel
|
| 10 |
Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders
|
Yen, Yee-Wen
|
|
2007
|
37 |
1 |
p. 73-83
|
artikel
|
| 11 |
Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows
|
Koo, Ja-Myeong
|
|
2007
|
37 |
1 |
p. 118-124
|
artikel
|
| 12 |
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints
|
Zimprich, Peter
|
|
2007
|
37 |
1 |
p. 102-109
|
artikel
|
| 13 |
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
|
Hao, Hu
|
|
2007
|
37 |
1 |
p. 2-8
|
artikel
|
| 14 |
Modeling Material Properties of Lead-Free Solder Alloys
|
Guo, Zhanli
|
|
2007
|
37 |
1 |
p. 23-31
|
artikel
|
| 15 |
Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications
|
Kim, Jong-Woong
|
|
2007
|
37 |
1 |
p. 9-16
|
artikel
|
| 16 |
The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi
|
Ventura, Tina
|
|
2007
|
37 |
1 |
p. 32-39
|
artikel
|
| 17 |
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys
|
Gourlay, C.M.
|
|
2007
|
37 |
1 |
p. 51-60
|
artikel
|
| 18 |
Tin Whisker Growth Induced by High Electron Current Density
|
Lin, Y. W.
|
|
2007
|
37 |
1 |
p. 17-22
|
artikel
|
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