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Journal description
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Details for article 4 of 18 found articles
| Title: |
Demonstration and Characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging |
| Author: |
Jo, Yun-Hwan Lee, Joo Won Seo, Sun-Kyoung Lee, Hyuck Mo Han, Hun Lee, Dong Chun |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2007) nr. 1 pages 110-117 |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 18 found articles
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