| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Characteristics of the Interfacial Microstructure of Chip-on-Plastic Joints under Thermal Cycling and Aging Treatment
|
Chen, Zhi Gang
|
|
2006
|
36 |
1 |
p. 45-55
|
artikel
|
| 2 |
Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging
|
Chen, H.T.
|
|
2006
|
36 |
1 |
p. 26-32
|
artikel
|
| 3 |
Deposition Characteristics of AlN Thin Film Prepared by the Dual Ion Beam Sputtering System
|
Hu, T. L.
|
|
2006
|
36 |
1 |
p. 81-87
|
artikel
|
| 4 |
Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints
|
Chen, Z.
|
|
2006
|
36 |
1 |
p. 17-25
|
artikel
|
| 5 |
Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints
|
Chen, H.T.
|
|
2006
|
36 |
1 |
p. 33-39
|
artikel
|
| 6 |
Growth of Nanocrystalline ZnSe:N Films by Pulsed Laser Deposition
|
Zhang, Tingwei
|
|
2006
|
36 |
1 |
p. 75-80
|
artikel
|
| 7 |
Hygrothermal Stability of Electrical Contacts Made from Silver and Graphite Electrically Conductive Pastes
|
Wang, Shoukai
|
|
2006
|
36 |
1 |
p. 65-74
|
artikel
|
| 8 |
Investigation of the Surface Removal Process of Silicon Carbide in Elastic Emission Machining
|
Kubota, Akihisa
|
|
2006
|
36 |
1 |
p. 92-97
|
artikel
|
| 9 |
Phase-Change Memory Device Using Si-Sb-Te Film for Low Power Operation and Multibit Storage
|
Qiao, Baowei
|
|
2006
|
36 |
1 |
p. 88-91
|
artikel
|
| 10 |
Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions
|
Chen, Y. S.
|
|
2006
|
36 |
1 |
p. 6-16
|
artikel
|
| 11 |
Strength of Soldered Joints Formed under Microgravity Conditions
|
Thomas, B.
|
|
2007
|
36 |
1 |
p. 1-5
|
artikel
|
| 12 |
Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability
|
Kim, Hyoung-Joon
|
|
2007
|
36 |
1 |
p. 56-64
|
artikel
|
| 13 |
Thermodynamic Properties of Liquid Ag-Bi-Sn Alloys
|
Li, Zuoan
|
|
2006
|
36 |
1 |
p. 40-44
|
artikel
|
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