| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Cathodoluminescence study of micro-crack-induced stress relief for AlN films on Si(111)
|
Sarusi, G.
|
|
2006
|
35 |
12 |
p. L15-L19
|
artikel
|
| 2 |
Diffusion behavior of Cu in Cu/electroless Ni and Cu/electroless Ni/Sn-37Pb solder joints in flip chip technology
|
Hsu, Yu-Ching
|
|
2006
|
35 |
12 |
p. 2164-2171
|
artikel
|
| 3 |
Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows
|
Chen, Zhong
|
|
2006
|
35 |
12 |
p. 2126-2134
|
artikel
|
| 4 |
Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys
|
He, M.
|
|
2006
|
35 |
12 |
p. 2098-2106
|
artikel
|
| 5 |
Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration
|
Lin, Y. L.
|
|
2006
|
35 |
12 |
p. 2147-2153
|
artikel
|
| 6 |
Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint
|
Xu, Luhua
|
|
2006
|
35 |
12 |
p. 2116-2125
|
artikel
|
| 7 |
Foreword
|
Chawla, Nik
|
|
2006
|
35 |
12 |
p. 2073
|
artikel
|
| 8 |
Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys
|
Song, Jenn-Ming
|
|
2006
|
35 |
12 |
p. 2154-2163
|
artikel
|
| 9 |
Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders
|
Dudek, M. A.
|
|
2006
|
35 |
12 |
p. 2088-2097
|
artikel
|
| 10 |
Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives
|
Gao, Feng
|
|
2006
|
35 |
12 |
p. 2081-2087
|
artikel
|
| 11 |
Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates
|
Huang, Chia-Wei
|
|
2006
|
35 |
12 |
p. 2135-2141
|
artikel
|
| 12 |
Nanoindentation on SnAgCu lead-free solder joints and analysis
|
Xu, Luhua
|
|
2006
|
35 |
12 |
p. 2107-2115
|
artikel
|
| 13 |
The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder
|
Chiang, Huann-Wu
|
|
2006
|
35 |
12 |
p. 2074-2080
|
artikel
|
| 14 |
Thickness determination of ultrathin oxide films and its application in magnetic tunnel junctions
|
Yang, J. Joshua
|
|
2006
|
35 |
12 |
p. 2142-2146
|
artikel
|
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