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Journal description
All volumes of the corresponding journal
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Details for article 5 of 14 found articles
| Title: |
Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration |
| Author: |
Lin, Y. L. Lai, Y. S. Tsai, C. M. Kao, C. R. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 35 (2006) nr. 12 pages 2147-2153 |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 14 found articles
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