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Journal description
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Details for article 10 of 14 found articles
| Title: |
Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives |
| Author: |
Gao, Feng Takemoto, Tadashi Nishikawa, Hiroshi |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 35 (2006) nr. 12 pages 2081-2087 |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 14 found articles
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