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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
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Details for article 2 of 14 found articles
| Title: |
Diffusion behavior of Cu in Cu/electroless Ni and Cu/electroless Ni/Sn-37Pb solder joints in flip chip technology |
| Author: |
Hsu, Yu-Ching Duh, Jenq-Gong |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 35 (2006) nr. 12 pages 2164-2171 |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 14 found articles
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