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                             47 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Accelerated lifetime estimation of thermosonic Cu ball bonds on Al metallization Lassnig, A.
 2013
 106 C p. 188-194
7 p.
 artikel
2 Adhesion analysis for on-chip interconnect structures by beam bending techniques with optical crack length determination Hentschel, R.L.
 2013
 106 C p. 172-176
5 p.
 artikel
3 Atomic layer deposition of transition metals for silicide contact formation: Growth characteristics and silicidation Kim, Hyungjun
 2013
 106 C p. 69-75
7 p.
 artikel
4 Author Index 2013
 106 C p. 219-224
6 p.
 artikel
5 Characterization of imprinted gratings based on transparent materials by transmission scatterometry Pietroy, David
 2013
 106 C p. 48-51
4 p.
 artikel
6 Chemisorption of ALD precursors in and on porous low-k films Verdonck, P.
 2013
 106 C p. 81-84
4 p.
 artikel
7 Comparison of quantum mechanical methods for the simulation of electronic transport through carbon nanotubes Zienert, Andreas
 2013
 106 C p. 100-105
6 p.
 artikel
8 Comprehensive TDDB lifetime prediction methodology for intrinsic and extrinsic failures in Cu interconnect dielectrics Suzumura, N.
 2013
 106 C p. 200-204
5 p.
 artikel
9 Copper electrodeposition into macroporous silicon arrays for through silicon via applications Defforge, T.
 2013
 106 C p. 160-163
4 p.
 artikel
10 Cu passivation for enhanced low temperature (⩽300°C) bonding in 3D integration Lim, D.F.
 2013
 106 C p. 144-148
5 p.
 artikel
11 CVD of cobalt–tungsten alloy film as a novel copper diffusion barrier Shimizu, Hideharu
 2013
 106 C p. 91-95
5 p.
 artikel
12 Decreasing reaction rate at the end of silicidation: In-situ CoSi2 XRD study and modeling Delattre, R.
 2013
 106 C p. 125-128
4 p.
 artikel
13 Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness Yang, C.-C.
 2013
 106 C p. 214-218
5 p.
 artikel
14 Effectiveness of wafer level test for electromigration wear out reporting in advanced CMOS interconnects reliability assessment Bana, F.
 2013
 106 C p. 195-199
5 p.
 artikel
15 Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits Made, Riko I
 2013
 106 C p. 149-154
6 p.
 artikel
16 Effect of TSV density on local stress concentration: Micro-Raman spectroscopy measurement and Finite Element Analysis Le Texier, F.
 2013
 106 C p. 139-143
5 p.
 artikel
17 Electrical characterization of CNT contacts with Cu Damascene top contact van der Veen, Marleen H.
 2013
 106 C p. 106-111
6 p.
 artikel
18 Electrochemical migration of Ag nanoink patterns controlled by atmospheric-pressure plasma Kim, Kwang-Seok
 2013
 106 C p. 27-32
6 p.
 artikel
19 Fabrication and characterization of tunable multiferroic Bi0.7Dy0.3FeO3 based on-chip micro-inductor Mandal, M.
 2013
 106 C p. 38-42
5 p.
 artikel
20 Formation of SnAg solder bump by multilayer electroplating Zhao, Qinghua
 2013
 106 C p. 33-37
5 p.
 artikel
21 Full reliability study of advanced metallization options for 30nm ½pitch interconnects Croes, Kristof
 2013
 106 C p. 210-213
4 p.
 artikel
22 Generation of periodic surface wrinkles using a single layer resin by a repetitive dividing volume (RDV) technique Park, Sang-Hu
 2013
 106 C p. 13-20
8 p.
 artikel
23 Highly adhesive electroless barrier/Cu-seed formation for high aspect ratio through-Si vias Inoue, Fumihiro
 2013
 106 C p. 164-167
4 p.
 artikel
24 2011 IITC ORGANIZING COMMITTEE 2013
 106 C p. 55-
1 p.
 artikel
25 Inside Front Cover - Editorial Board 2013
 106 C p. IFC-
1 p.
 artikel
26 Interface engineering for the TaN/Ta barrier film deposition process to control Ta-crystal growth Gerlich, Lukas
 2013
 106 C p. 63-68
6 p.
 artikel
27 Investigation of aluminum film properties and microstructure for replacement metal gate application Huang, R.P.
 2013
 106 C p. 56-62
7 p.
 artikel
28 Investigation of CH4, NH3, H2 and He plasma treatment on porous low-k films and its effects on resisting moisture absorption and ions penetration Lu, Hai-Sheng
 2013
 106 C p. 85-90
6 p.
 artikel
29 2011 MAM Committee 2013
 106 C p. 54-
1 p.
 artikel
30 Microstructural void environment characterization by electron imaging in 45nm technology node to link electromigration and copper microstructure Galand, R.
 2013
 106 C p. 168-171
4 p.
 artikel
31 Modeling the constitutive and frictional behavior of PTFE flexible stamps for nanoimprint lithography Sonne, M.R.
 2013
 106 C p. 1-8
8 p.
 artikel
32 Moisture absorption impact on Cu alloy/low-k reliability during process queue time Tsuchiya, H.
 2013
 106 C p. 205-209
5 p.
 artikel
33 Nanoindentation for reliability assessment of ULK films and interconnects structures Yeap, Kong Boon
 2013
 106 C p. 182-187
6 p.
 artikel
34 On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing Civale, Yann
 2013
 106 C p. 155-159
5 p.
 artikel
35 Reactively sputtered HfO2 and Ba(Zr0.2Ti0.8)O3–HfO2 dielectrics for metal–insulator–metal capacitor applications Zhang, Li-Feng
 2013
 106 C p. 96-99
4 p.
 artikel
36 Selected papers from the 20th European Workshop on Materials for Advanced Metallization 2011 Schulz, Stefan E.
 2013
 106 C p. 53-
1 p.
 artikel
37 Selective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias Maestre Caro, A.
 2013
 106 C p. 76-80
5 p.
 artikel
38 Series resistance study of Schottky diodes developed on 4H-SiC wafers using a contact of titanium or molybdenum Shili, K.
 2013
 106 C p. 43-47
5 p.
 artikel
39 Si ohmic contacts on N-type SiC studied by XPS Cichoň, Stanislav
 2013
 106 C p. 132-138
7 p.
 artikel
40 Stress-induced voiding in nickel silicide Futase, Takuya
 2013
 106 C p. 116-120
5 p.
 artikel
41 Structural optimization of the micro-membrane for a novel surface stress-based capacitive biosensor Zhang, Wendong
 2013
 106 C p. 9-12
4 p.
 artikel
42 Study of Schottky barrier height modulation for NiSi/Si contact with an antimony interlayer Guo, Xiao
 2013
 106 C p. 121-124
4 p.
 artikel
43 Study of the impact of doping concentration and Schottky barrier height on ohmic contacts to n-type germanium Firrincieli, A.
 2013
 106 C p. 129-131
3 p.
 artikel
44 Surface microstructuring and protein patterning using hyaluronan derivatives Márquez-Posadas, M.C.
 2013
 106 C p. 21-26
6 p.
 artikel
45 Table of Contents 2013
 106 C p. v-vii
nvt p.
 artikel
46 Texture characterization of the NiSi film on Si substrate Kimura, Hiroshi
 2013
 106 C p. 112-115
4 p.
 artikel
47 Water uptake of a low-κ dielectric film: Combining capacitance and gravimetric measurements Kubasch, C.
 2013
 106 C p. 177-181
5 p.
 artikel
                             47 gevonden resultaten
 
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