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Journal description
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Details for article 34 of 47 found articles
| Title: |
On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing |
| Author: |
Civale, Yann Croes, Kristof Miyamori, Yuichi Velenis, Dimitrios Redolfi, Augusto Thangaraju, Sarasvathi Ammel, Annemie Van Cherman, Vladimir Plas, Geert Van der Cockburn, Andrew Gravey, Virginie Kumar, Nirajan Cao, Zhitao Travaly, Youssef Tőkei, Zsolt Beyne, Eric Swinnen, Bart |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 106 (2013) nr. C pages 5 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 34 of 47 found articles
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