| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A 2D compact model for lightly doped DG MOSFETs (P-DGFETs) including negative bias temperature instability (NBTI) and short channel effects (SCEs)
|
Samy, Omnia
|
|
2016
|
67 |
C |
p. 82-88
|
artikel
|
| 2 |
Advanced thermal simulation of SiGe:C HBTs including back-end-of-line
|
d'Alessandro, Vincenzo
|
|
2016
|
67 |
C |
p. 38-45
|
artikel
|
| 3 |
Analysis of aging effects - From transistor to system level
|
Taddiken, Maike
|
|
2016
|
67 |
C |
p. 64-73
|
artikel
|
| 4 |
Analysis of nonlinear heat exchange phenomena in natural convection cooled electronic systems
|
De Mey, Gilbert
|
|
2016
|
67 |
C |
p. 15-20
|
artikel
|
| 5 |
Constitutive modeling of solder alloys for drop-impact applications
|
Wong, E.H.
|
|
2016
|
67 |
C |
p. 135-142
|
artikel
|
| 6 |
Corrigendum to “A subgap density of states modeling for the transient characteristics in oxide-based thin-film transistors” [Microelectron. Reliab. 60 (2016) 67–69]
|
Wang, Weiliang
|
|
2016
|
67 |
C |
p. 159
|
artikel
|
| 7 |
Editorial board
|
|
|
2016
|
67 |
C |
p. IFC
|
artikel
|
| 8 |
Effectiveness of a hardware-based approach to detect resistive-open defects in SRAM cells under process variations
|
Gomez, A.F.
|
|
2016
|
67 |
C |
p. 150-158
|
artikel
|
| 9 |
Enhanced thermal characterization method of microscale heatsink structures
|
Takács, G.
|
|
2016
|
67 |
C |
p. 21-28
|
artikel
|
| 10 |
Enhancement of light-emitting diode reliability using silicone microsphere in encapsulant
|
Jang, Inseok
|
|
2016
|
67 |
C |
p. 94-98
|
artikel
|
| 11 |
Experimental characterization of the predictive thermal behaviour model of a surface-mounted soft magnetic composite inductor
|
Monier-Vinard, Eric
|
|
2016
|
67 |
C |
p. 54-63
|
artikel
|
| 12 |
Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications
|
Tsai, M.Y.
|
|
2016
|
67 |
C |
p. 120-128
|
artikel
|
| 13 |
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits
|
Melamed, Samson
|
|
2016
|
67 |
C |
p. 2-8
|
artikel
|
| 14 |
Influence of fin number on hot-carrier injection stress induced degradation in bulk FinFETs
|
Zhang, Wenqi
|
|
2016
|
67 |
C |
p. 89-93
|
artikel
|
| 15 |
Multilevel logic and thermal co-simulation
|
Jani, Lázár
|
|
2016
|
67 |
C |
p. 46-53
|
artikel
|
| 16 |
Rail to rail radiation hardened operational amplifier in standard CMOS technology with standard layout techniques
|
Agostinho, Peterson R.
|
|
2016
|
67 |
C |
p. 99-103
|
artikel
|
| 17 |
Similarity approach for reducing qualification tests of electronic components
|
Stoyanov, Stoyan
|
|
2016
|
67 |
C |
p. 111-119
|
artikel
|
| 18 |
Statistical distributions of row-hammering induced failures in DDR3 components
|
Park, Kyungbae
|
|
2016
|
67 |
C |
p. 143-149
|
artikel
|
| 19 |
Study of total ionizing dose induced read bit errors in magneto-resistive random access memory
|
Zhang, Haohao
|
|
2016
|
67 |
C |
p. 104-110
|
artikel
|
| 20 |
The distributed thermal model of fin field effect transistor
|
Zubert, Mariusz
|
|
2016
|
67 |
C |
p. 9-14
|
artikel
|
| 21 |
The impact of BTI aging on the reliability of level shifters in nano-scale CMOS technology
|
Halak, Basel
|
|
2016
|
67 |
C |
p. 74-81
|
artikel
|
| 22 |
The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs
|
Liu, E
|
|
2016
|
67 |
C |
p. 29-37
|
artikel
|
| 23 |
To the Special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC’15
|
Rencz, Marta
|
|
2016
|
67 |
C |
p. 1
|
artikel
|
| 24 |
X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm
|
Shen, Junjie
|
|
2016
|
67 |
C |
p. 129-134
|
artikel
|
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