| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis of origin of measured 1/f noise in high-power semiconductor laser diodes far below threshold current
|
Guan, Jian
|
|
2016
|
59 |
C |
p. 55-59
5 p.
|
artikel
|
| 2 |
An improved modeling for life prediction of high-power white LED based on Weibull right approximation method
|
Zhang, Jianping
|
|
2016
|
59 |
C |
p. 49-54
6 p.
|
artikel
|
| 3 |
A thermal cycling reliability study of ultrasonically bonded copper wires
|
Arjmand, Elaheh
|
|
2016
|
59 |
C |
p. 126-133
8 p.
|
artikel
|
| 4 |
B-Spline X-Ray Diffraction Imaging — Rapid non-destructive measurement of die warpage in ball grid array packages
|
Cowley, A.
|
|
2016
|
59 |
C |
p. 108-116
9 p.
|
artikel
|
| 5 |
Creep fatigue models of solder joints: A critical review
|
Wong, E.H.
|
|
2016
|
59 |
C |
p. 1-12
12 p.
|
artikel
|
| 6 |
Degradation of pMOSFETs due to hot electron induced punchthrough
|
Son, Donghee
|
|
2016
|
59 |
C |
p. 13-17
5 p.
|
artikel
|
| 7 |
Degradation study of single poly radiation sensors by monitoring charge trapping
|
Pikhay, Evgeny
|
|
2016
|
59 |
C |
p. 18-25
8 p.
|
artikel
|
| 8 |
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation
|
Zahedmanesh, Houman
|
|
2016
|
59 |
C |
p. 102-107
6 p.
|
artikel
|
| 9 |
Drain current model for double-gate tunnel field-effect transistor with hetero-gate-dielectric and source-pocket
|
Wang, Ping
|
|
2016
|
59 |
C |
p. 30-36
7 p.
|
artikel
|
| 10 |
Editorial Board
|
|
|
2016
|
59 |
C |
p. IFC-
1 p.
|
artikel
|
| 11 |
Electrical characteristics of a-IGZO transistors along the in-plane axis during outward bending
|
Park, Chang Bum
|
|
2016
|
59 |
C |
p. 37-43
7 p.
|
artikel
|
| 12 |
Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection
|
Ohyama, Masaki
|
|
2016
|
59 |
C |
p. 134-139
6 p.
|
artikel
|
| 13 |
Experimental Evaluation of Circuit-Based Modeling of the NBTI Effects in Double-Gate FinFETs
|
Jankovic, Nebojsa D.
|
|
2016
|
59 |
C |
p. 26-29
4 p.
|
artikel
|
| 14 |
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing
|
Cheng, Hsien-Chie
|
|
2016
|
59 |
C |
p. 84-94
11 p.
|
artikel
|
| 15 |
Investigation of MBE grown inverted GaAs quantum dots
|
Nemcsics, Ákos
|
|
2016
|
59 |
C |
p. 60-63
4 p.
|
artikel
|
| 16 |
[No title]
|
Gan, Chong Leong
|
|
2016
|
59 |
C |
p. 140-
1 p.
|
artikel
|
| 17 |
Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly
|
Zarmai, M.T.
|
|
2016
|
59 |
C |
p. 117-125
9 p.
|
artikel
|
| 18 |
Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement
|
Eleffendi, Mohd. Amir
|
|
2016
|
59 |
C |
p. 73-83
11 p.
|
artikel
|
| 19 |
The ESD protection characteristic and low-frequency noise analysis of GaN Schottky barrier diode with fluorine-based plasma treatment
|
Chiu, Hsien-Chin
|
|
2016
|
59 |
C |
p. 44-48
5 p.
|
artikel
|
| 20 |
Thermo-fluid simulation for the thermal design of the IGBT module in the power conversion system
|
Han, Chang-Woo
|
|
2016
|
59 |
C |
p. 64-72
9 p.
|
artikel
|
| 21 |
Validation of TSV thermo-mechanical simulation by stress measurement
|
Feng, Wei
|
|
2016
|
59 |
C |
p. 95-101
7 p.
|
artikel
|
Tijdschrift beschrijving