| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A health indicator method for degradation detection of electronic products
|
Kumar, Sachin
|
|
2012
|
52 |
2 |
p. 439-445
7 p.
|
artikel
|
| 2 |
A technique to mitigate impact of process, voltage and temperature variations on design metrics of SRAM Cell
|
Islam, A.
|
|
2012
|
52 |
2 |
p. 405-411
7 p.
|
artikel
|
| 3 |
BCB-to-oxide bonding technology for 3D integration
|
Lin, S.L.
|
|
2012
|
52 |
2 |
p. 352-355
4 p.
|
artikel
|
| 4 |
Current transport and formation of energy structures in narrow Au/n-GaAs Schottky diodes
|
Mamedov, R.K.
|
|
2012
|
52 |
2 |
p. 418-424
7 p.
|
artikel
|
| 5 |
Dependence of the Au/SnO x /n-LTPS/glass thin film MOS Schottky diode CO gas sensing performances on operating temperature
|
Juang, Feng-Renn
|
|
2012
|
52 |
2 |
p. 425-429
5 p.
|
artikel
|
| 6 |
Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning
|
Heo, W.
|
|
2012
|
52 |
2 |
p. 412-417
6 p.
|
artikel
|
| 7 |
Electromigration reliability of interconnections in RF low noise amplifier circuit
|
He, Feifei
|
|
2012
|
52 |
2 |
p. 446-454
9 p.
|
artikel
|
| 8 |
Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding
|
Chen, Y.J.
|
|
2012
|
52 |
2 |
p. 381-384
4 p.
|
artikel
|
| 9 |
Guest Editorial – Low Temperature Processing for Microelectronics and Microsystems Packaging
|
Suga, Tadatomo
|
|
2012
|
52 |
2 |
p. 301-
1 p.
|
artikel
|
| 10 |
High-lead flip chip bump cracking on the thin organic substrate in a module package
|
Jang, J.W.
|
|
2012
|
52 |
2 |
p. 455-460
6 p.
|
artikel
|
| 11 |
High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure
|
Dong, Zhihua
|
|
2012
|
52 |
2 |
p. 434-438
5 p.
|
artikel
|
| 12 |
Inside front cover - Editorial board
|
|
|
2012
|
52 |
2 |
p. IFC-
1 p.
|
artikel
|
| 13 |
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials
|
Wang, Chenxi
|
|
2012
|
52 |
2 |
p. 347-351
5 p.
|
artikel
|
| 14 |
Low temperature bonding technology for 3D integration
|
Ko, Cheng-Ta
|
|
2012
|
52 |
2 |
p. 302-311
10 p.
|
artikel
|
| 15 |
Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
|
Tan, C.S.
|
|
2012
|
52 |
2 |
p. 321-324
4 p.
|
artikel
|
| 16 |
Low temperature direct bonding: An attractive technique for heterostructures build-up
|
Moriceau, H.
|
|
2012
|
52 |
2 |
p. 331-341
11 p.
|
artikel
|
| 17 |
Low temperature fabricated conductive lines on flexible substrate by inkjet printing
|
Liu, Yu-Feng
|
|
2012
|
52 |
2 |
p. 391-397
7 p.
|
artikel
|
| 18 |
Low temperature fabrication of Ni–P metallic patterns on ITO substrates utilizing inkjet printing
|
Liu, Yih-Ming
|
|
2012
|
52 |
2 |
p. 398-404
7 p.
|
artikel
|
| 19 |
Low-temperature low-pressure die attach with hybrid silver particle paste
|
Suganuma, K.
|
|
2012
|
52 |
2 |
p. 375-380
6 p.
|
artikel
|
| 20 |
Low temperature nanointegration for emerging biomedical applications
|
Howlader, Matiar M.R.
|
|
2012
|
52 |
2 |
p. 361-374
14 p.
|
artikel
|
| 21 |
Nanoadhesion layer for enhanced Si–Si and Si–SiN wafer bonding
|
Kondou, Ryuichi
|
|
2012
|
52 |
2 |
p. 342-346
5 p.
|
artikel
|
| 22 |
Nanoporous gold bumps for low temperature bonding
|
Oppermann, Hermann
|
|
2012
|
52 |
2 |
p. 356-360
5 p.
|
artikel
|
| 23 |
Overview of low temperature hydrophilic Ge to Si direct bonding for heterogeneous integration
|
Byun, Ki Yeol
|
|
2012
|
52 |
2 |
p. 325-330
6 p.
|
artikel
|
| 24 |
Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations
|
Lin, Chi-Pu
|
|
2012
|
52 |
2 |
p. 385-390
6 p.
|
artikel
|
| 25 |
To the understanding of the formation of the III–V based droplet epitxial nanorings
|
Nemcsics, Ákos
|
|
2012
|
52 |
2 |
p. 430-433
4 p.
|
artikel
|
| 26 |
Wafer-level Cu–Cu bonding technology
|
Tang, Ya-Sheng
|
|
2012
|
52 |
2 |
p. 312-320
9 p.
|
artikel
|
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