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Journal description
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Details for article 15 of 26 found articles
| Title: |
Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement |
| Author: |
Tan, C.S. Lim, D.F. Ang, X.F. Wei, J. Leong, K.C. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 52 (2012) nr. 2 pages 4 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 26 found articles
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