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Journal description
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Details for article 3 of 26 found articles
| Title: |
BCB-to-oxide bonding technology for 3D integration |
| Author: |
Lin, S.L. Huang, W.C. Ko, C.T. Chen, K.N. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 52 (2012) nr. 2 pages 4 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 26 found articles
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