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                                       Details for article 6 of 26 found articles
 
 
  Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning
 
 
Title: Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning
Author: Heo, W.
Lee, N.-E.
Appeared in: Microelectronics reliability
Paging: Volume 52 (2012) nr. 2 pages 6 p.
Year: 2012
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 6 of 26 found articles
 
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