| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated flowers of sulfur test method for power semiconductor modules
|
Kaminski, Daniel T.
|
|
|
173 |
C |
p.
|
artikel
|
| 2 |
A physics-based electromigration model for advanced interconnects
|
Chen, Wangyong
|
|
|
173 |
C |
p.
|
artikel
|
| 3 |
Condition monitoring of a DC-link capacitor in an inverter with a front-end diode rectifier under imbalanced three-phase supply voltage
|
Yamasoto, Takuma
|
|
|
173 |
C |
p.
|
artikel
|
| 4 |
Conducted EMI assessment of aging power Si-MOSFET in 3 phase inverter
|
TLIG, Mohamed
|
|
|
173 |
C |
p.
|
artikel
|
| 5 |
C-SMART: A preprocessor for neural network performance and reliability under radiation
|
Justus Rajappa, Anuj
|
|
|
173 |
C |
p.
|
artikel
|
| 6 |
Degradation of high reliability lead-free solder joints under harsh thermal cycling test
|
Yeom, Jeyun
|
|
|
173 |
C |
p.
|
artikel
|
| 7 |
Editorial Board
|
|
|
|
173 |
C |
p.
|
artikel
|
| 8 |
Effect of Al content on microstructure and solder joint reliability of SAC305-2.0Sb-3.0Bi-0.1Ni solder alloys
|
Xiang, Yipeng
|
|
|
173 |
C |
p.
|
artikel
|
| 9 |
Effect of electro-mechanical coupling on the electrical performance and microvoid evolution of Sn3.0Ag0.5Cu solder joint
|
Guo, Weiqi
|
|
|
173 |
C |
p.
|
artikel
|
| 10 |
Electrical and reliability characterization with an optimized extrapolation model of two- and three-dimensional metal-insulator-metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions
|
Falidas, Konstantinos Efstathios
|
|
|
173 |
C |
p.
|
artikel
|
| 11 |
Free-standing silver nanobelt foils for sintering die bonding of power electronics and its power cycle reliability
|
Wang, Xinda
|
|
|
173 |
C |
p.
|
artikel
|
| 12 |
Grain morphology effect on interfacial void closure in Cu–Cu bonding for advanced semiconductor packaging
|
Jiang, Han
|
|
|
173 |
C |
p.
|
artikel
|
| 13 |
Impact of near interface defects on NO annealed SiC MOSFET mobility
|
Wen, Yu-Xin
|
|
|
173 |
C |
p.
|
artikel
|
| 14 |
Influence of die and lid shapes on void formation in solder thermal interface materials
|
Aman, Nurul Ashikin Mohd Nazrul
|
|
|
173 |
C |
p.
|
artikel
|
| 15 |
Investigation of DFF cells SEU effect for 14 nm bulk silicon FinFET technology irradiated by heavy ions
|
Li, Hai-song
|
|
|
173 |
C |
p.
|
artikel
|
| 16 |
Low-voltage Schottky p-GaN HEMT properties under extreme repetitive short-circuit operation conditions: 2DEG pinch-off, stability, aging, robustness and failure-modes analysis
|
Richardeau, F.
|
|
|
173 |
C |
p.
|
artikel
|
| 17 |
Microstructure and diffusion mechanisms in nano-Cu sintered joints during aging: Effects of joint size, porosity, and aging atmosphere
|
Wang, Shuaiqi
|
|
|
173 |
C |
p.
|
artikel
|
| 18 |
Modified TCAD simulation approach for 4H-SiC JBS diode to investigate electron trapping effects
|
Kumari, Shikha
|
|
|
173 |
C |
p.
|
artikel
|
| 19 |
Monitoring method for bond wire aging in IGBT modules based on gate voltage ringing frequency
|
Du, Mingxing
|
|
|
173 |
C |
p.
|
artikel
|
| 20 |
Physics-informed deep learning approach for nanoindentation-based thin film analysis
|
Ozdemir, Yusuf Burak
|
|
|
173 |
C |
p.
|
artikel
|
| 21 |
Reliability of discrete SiC MOSFETs under severe temperature-shock and power cycling tests
|
Heimler, Patrick
|
|
|
173 |
C |
p.
|
artikel
|
| 22 |
RHBD current-mode bandgap with SET isolation using PVT-independent sensors
|
Cardenas Chavez, Jaime
|
|
|
173 |
C |
p.
|
artikel
|
| 23 |
Significance of phase formation in multicomponent lead-free solder alloys
|
Zareipour, Farzaneh
|
|
|
173 |
C |
p.
|
artikel
|
| 24 |
Stress–strain analysis and optimization of BGA stacked solder joints under extreme temperatures based on orthogonal design and grey relational analysis
|
Chen, Yonglin
|
|
|
173 |
C |
p.
|
artikel
|
| 25 |
Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm
|
Wei, Jisheng
|
|
|
173 |
C |
p.
|
artikel
|
| 26 |
Thermal-mechanical coupling analysis of Micro-LED bonding based on copper pillar bump
|
Fu, Hao
|
|
|
173 |
C |
p.
|
artikel
|
| 27 |
Toward robust structure function-based thermal analysis: Quantitative metrics for semiconductor packaging evaluation
|
Song, Wonbin
|
|
|
173 |
C |
p.
|
artikel
|
| 28 |
Towards Extended Hückel model-based reliability performance enhancement of gate stack graphene nanoribbon field effect transistor
|
Anshul,
|
|
|
173 |
C |
p.
|
artikel
|
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