| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A comprehensive framework for cell-aware diagnosis of customer returns
|
d'Hondt, P.
|
|
|
135 |
C |
p.
|
article
|
| 2 |
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor
|
Loganathan, P.
|
|
|
135 |
C |
p.
|
article
|
| 3 |
Analysis of extensive wetting angle vs. cooling rate data in Bi-, Zn- and Sn-based solder alloys
|
Silva, Bismarck Luiz
|
|
|
135 |
C |
p.
|
article
|
| 4 |
A new guard ring for ionizing radiation tolerance enhancement in single-photon avalanche diodes
|
Shojaee, Fatemeh
|
|
|
135 |
C |
p.
|
article
|
| 5 |
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis
|
Lois, Liao Jinzhi
|
|
|
135 |
C |
p.
|
article
|
| 6 |
A simulation-based evaluation of single-event burnout mechanisms and varied SEB hardening designs in power LDMOS transistors
|
Lei, Yibo
|
|
|
135 |
C |
p.
|
article
|
| 7 |
Characterization of electrically stressed power device metallization using nano-CT imaging
|
Mueller, Dominik
|
|
|
135 |
C |
p.
|
article
|
| 8 |
Correction strategy for wear-out prediction of PV inverters considering the mission profile resolution effects
|
Silva, R.P.
|
|
|
135 |
C |
p.
|
article
|
| 9 |
Corrigendum to “A soft-error-tolerant, 1.25 GHz to 3.125 GHz, 3.18 ps RMS-jitter CPPLL in 40 nm CMOS process” [Microelectron. Reliab. volume 124 (2021) 114337]
|
Guo, Qiancheng
|
|
|
135 |
C |
p.
|
article
|
| 10 |
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects
|
Thor, M.H.
|
|
|
135 |
C |
p.
|
article
|
| 11 |
Early detection of photovoltaic system inverter faults
|
Omaña, Martin
|
|
|
135 |
C |
p.
|
article
|
| 12 |
Editorial Board
|
|
|
|
135 |
C |
p.
|
article
|
| 13 |
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry
|
Peng, Yanzhi
|
|
|
135 |
C |
p.
|
article
|
| 14 |
Effects of interfacial bonding strength on the formation of conductive anodic filament in polyphenylene oxide/glass fiber laminates
|
Wang, Zhongwei
|
|
|
135 |
C |
p.
|
article
|
| 15 |
Effects of silver nano-particles and nano-wires on properties of electrically conductive adhesives
|
Liu, Hao
|
|
|
135 |
C |
p.
|
article
|
| 16 |
Enhancing reliability of photovoltaic power electronic converters under dynamic irradiance conditions
|
Jacobo Tapia, Renato
|
|
|
135 |
C |
p.
|
article
|
| 17 |
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
|
van Dijk, Marius
|
|
|
135 |
C |
p.
|
article
|
| 18 |
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method
|
Ting, Siong Luong
|
|
|
135 |
C |
p.
|
article
|
| 19 |
Functional cyclic bending test for integrated inductors on flexible Kapton substrate
|
Freitas, Wilson J.
|
|
|
135 |
C |
p.
|
article
|
| 20 |
Gate-switching-stress test: Electrical parameter stability of SiC MOSFETs in switching operation
|
Salmen, P.
|
|
|
135 |
C |
p.
|
article
|
| 21 |
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures
|
Cussac, G.
|
|
|
135 |
C |
p.
|
article
|
| 22 |
Investigations on deformation and fracture behaviors of the multi-alloyed SnAgCu solder and solder joint by in-situ observation
|
Zhu, Tangkui
|
|
|
135 |
C |
p.
|
article
|
| 23 |
Layout based radiation hardening techniques against single-event transient
|
Liang, Bin
|
|
|
135 |
C |
p.
|
article
|
| 24 |
Local capacitance-voltage profiling and deep level transient spectroscopy of SiO2/SiC interfaces by scanning nonlinear dielectric microscopy
|
Yamasue, Kohei
|
|
|
135 |
C |
p.
|
article
|
| 25 |
Modified Norris-Landzberg model for Pb-free solder joint reliability evaluation
|
Xie, Weidong
|
|
|
135 |
C |
p.
|
article
|
| 26 |
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
|
Nashrudin, Muhammad Naqib
|
|
|
135 |
C |
p.
|
article
|
| 27 |
Reinforcement learning to reduce failures in SOT-MRAM switching
|
Ender, Johannes
|
|
|
135 |
C |
p.
|
article
|
| 28 |
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
|
Yu, Weiyuan
|
|
|
135 |
C |
p.
|
article
|
| 29 |
The influence of the vibration test mode on the failure rate of electrical connectors
|
Krüger, Kevin
|
|
|
135 |
C |
p.
|
article
|
| 30 |
The mechanism of heavy ion incident angle on the reliability of MOS device
|
Li, Zongzhen
|
|
|
135 |
C |
p.
|
article
|
| 31 |
The role of anchor imposed motion in the failure of MEMS microphones under free fall tests
|
Ghisi, Aldo
|
|
|
135 |
C |
p.
|
article
|
| 32 |
Tilt- and warpage measurement as inline quality assessment tool
|
May, D.
|
|
|
135 |
C |
p.
|
article
|
| 33 |
Void and solder joint detection for chip resistors based on X-ray images and deep neural networks
|
Pang, Shuiling
|
|
|
135 |
C |
p.
|
article
|
| 34 |
Wettable flank routable thin MicroLeadFrame for automotive applications
|
Kim, Byong Jin
|
|
|
135 |
C |
p.
|
article
|
Journal description