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Journal description
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Details for article 33 of 34 found articles
| Title: |
Void and solder joint detection for chip resistors based on X-ray images and deep neural networks |
| Author: |
Pang, Shuiling Chen, Meiyun Ta, Shiwo Wu, Heng Takamasu, Kiyoshi |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 135 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 33 of 34 found articles
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