|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 28 of 34 found articles
| Title: |
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP |
| Author: |
Yu, Weiyuan Li, Binbin Wu, Baolei Wang, Fengfeng Wang, Mingkang |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 135 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 28 of 34 found articles
| << previous | next >> |