nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comprehensive framework for cell-aware diagnosis of customer returns
|
d'Hondt, P. |
|
|
135 |
C |
p. |
artikel |
2 |
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor
|
Loganathan, P. |
|
|
135 |
C |
p. |
artikel |
3 |
Analysis of extensive wetting angle vs. cooling rate data in Bi-, Zn- and Sn-based solder alloys
|
Silva, Bismarck Luiz |
|
|
135 |
C |
p. |
artikel |
4 |
A new guard ring for ionizing radiation tolerance enhancement in single-photon avalanche diodes
|
Shojaee, Fatemeh |
|
|
135 |
C |
p. |
artikel |
5 |
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis
|
Lois, Liao Jinzhi |
|
|
135 |
C |
p. |
artikel |
6 |
A simulation-based evaluation of single-event burnout mechanisms and varied SEB hardening designs in power LDMOS transistors
|
Lei, Yibo |
|
|
135 |
C |
p. |
artikel |
7 |
Characterization of electrically stressed power device metallization using nano-CT imaging
|
Mueller, Dominik |
|
|
135 |
C |
p. |
artikel |
8 |
Correction strategy for wear-out prediction of PV inverters considering the mission profile resolution effects
|
Silva, R.P. |
|
|
135 |
C |
p. |
artikel |
9 |
Corrigendum to “A soft-error-tolerant, 1.25 GHz to 3.125 GHz, 3.18 ps RMS-jitter CPPLL in 40 nm CMOS process” [Microelectron. Reliab. volume 124 (2021) 114337]
|
Guo, Qiancheng |
|
|
135 |
C |
p. |
artikel |
10 |
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects
|
Thor, M.H. |
|
|
135 |
C |
p. |
artikel |
11 |
Early detection of photovoltaic system inverter faults
|
Omaña, Martin |
|
|
135 |
C |
p. |
artikel |
12 |
Editorial Board
|
|
|
|
135 |
C |
p. |
artikel |
13 |
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry
|
Peng, Yanzhi |
|
|
135 |
C |
p. |
artikel |
14 |
Effects of interfacial bonding strength on the formation of conductive anodic filament in polyphenylene oxide/glass fiber laminates
|
Wang, Zhongwei |
|
|
135 |
C |
p. |
artikel |
15 |
Effects of silver nano-particles and nano-wires on properties of electrically conductive adhesives
|
Liu, Hao |
|
|
135 |
C |
p. |
artikel |
16 |
Enhancing reliability of photovoltaic power electronic converters under dynamic irradiance conditions
|
Jacobo Tapia, Renato |
|
|
135 |
C |
p. |
artikel |
17 |
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
|
van Dijk, Marius |
|
|
135 |
C |
p. |
artikel |
18 |
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method
|
Ting, Siong Luong |
|
|
135 |
C |
p. |
artikel |
19 |
Functional cyclic bending test for integrated inductors on flexible Kapton substrate
|
Freitas, Wilson J. |
|
|
135 |
C |
p. |
artikel |
20 |
Gate-switching-stress test: Electrical parameter stability of SiC MOSFETs in switching operation
|
Salmen, P. |
|
|
135 |
C |
p. |
artikel |
21 |
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures
|
Cussac, G. |
|
|
135 |
C |
p. |
artikel |
22 |
Investigations on deformation and fracture behaviors of the multi-alloyed SnAgCu solder and solder joint by in-situ observation
|
Zhu, Tangkui |
|
|
135 |
C |
p. |
artikel |
23 |
Layout based radiation hardening techniques against single-event transient
|
Liang, Bin |
|
|
135 |
C |
p. |
artikel |
24 |
Local capacitance-voltage profiling and deep level transient spectroscopy of SiO2/SiC interfaces by scanning nonlinear dielectric microscopy
|
Yamasue, Kohei |
|
|
135 |
C |
p. |
artikel |
25 |
Modified Norris-Landzberg model for Pb-free solder joint reliability evaluation
|
Xie, Weidong |
|
|
135 |
C |
p. |
artikel |
26 |
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
|
Nashrudin, Muhammad Naqib |
|
|
135 |
C |
p. |
artikel |
27 |
Reinforcement learning to reduce failures in SOT-MRAM switching
|
Ender, Johannes |
|
|
135 |
C |
p. |
artikel |
28 |
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
|
Yu, Weiyuan |
|
|
135 |
C |
p. |
artikel |
29 |
The influence of the vibration test mode on the failure rate of electrical connectors
|
Krüger, Kevin |
|
|
135 |
C |
p. |
artikel |
30 |
The mechanism of heavy ion incident angle on the reliability of MOS device
|
Li, Zongzhen |
|
|
135 |
C |
p. |
artikel |
31 |
The role of anchor imposed motion in the failure of MEMS microphones under free fall tests
|
Ghisi, Aldo |
|
|
135 |
C |
p. |
artikel |
32 |
Tilt- and warpage measurement as inline quality assessment tool
|
May, D. |
|
|
135 |
C |
p. |
artikel |
33 |
Void and solder joint detection for chip resistors based on X-ray images and deep neural networks
|
Pang, Shuiling |
|
|
135 |
C |
p. |
artikel |
34 |
Wettable flank routable thin MicroLeadFrame for automotive applications
|
Kim, Byong Jin |
|
|
135 |
C |
p. |
artikel |