| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs
|
Cai, Chongyang
|
|
|
119 |
C |
p.
|
artikel
|
| 2 |
Analysis of the viscoplastic behavior of Pb-free solder using lap shear joints
|
Basit, Munshi M.
|
|
|
119 |
C |
p.
|
artikel
|
| 3 |
A simulating method of moisture continuous diffusion under changing temperatures and analysis of moisture-induced stresses covering moisture desorption and reflow processes for the QFN
|
Shi, Xinghua
|
|
|
119 |
C |
p.
|
artikel
|
| 4 |
Asymmetric aging effect on modern microprocessors
|
Gabbay, Freddy
|
|
|
119 |
C |
p.
|
artikel
|
| 5 |
A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions
|
Yang, Hung-Chun
|
|
|
119 |
C |
p.
|
artikel
|
| 6 |
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
|
Schemmel, Reinhard
|
|
|
119 |
C |
p.
|
artikel
|
| 7 |
Design optimization of a miniaturized thermoelectric generator via parametric model order reduction
|
Yuan, Chengdong
|
|
|
119 |
C |
p.
|
artikel
|
| 8 |
Diagnostic-driven yield engineering under atypical wafer foundry conditions
|
Ngow, Y.T.
|
|
|
119 |
C |
p.
|
artikel
|
| 9 |
Dynamic resistance variation mapping technique for defect isolation
|
Thor, M.H.
|
|
|
119 |
C |
p.
|
artikel
|
| 10 |
Editorial Board
|
|
|
|
119 |
C |
p.
|
artikel
|
| 11 |
Effect of solder joint size and composition on liquid-assisted healing
|
Siroky, Georg
|
|
|
119 |
C |
p.
|
artikel
|
| 12 |
Electromigration in solder joints: A cross-sectioned model system for real-time observation
|
AbdelAziz, Mostafa
|
|
|
119 |
C |
p.
|
artikel
|
| 13 |
Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO2/Al2O3 laterally stacked gate oxide
|
Tripathy, Manas Ranjan
|
|
|
119 |
C |
p.
|
artikel
|
| 14 |
Memoryless nonlinearity in IT JL FinFET with spacer technology: Investigation towards reliability
|
Vandana, B.
|
|
|
119 |
C |
p.
|
artikel
|
| 15 |
Parametric system-level models for position-control of novel electromagnetic free flight microactuator
|
Schütz, Arwed
|
|
|
119 |
C |
p.
|
artikel
|
| 16 |
Performance and reliability improvement of 905 nm high power laser diode by design, fabrication and characterization of high damage threshold mirrors
|
Ghadimi-Mahani, A.
|
|
|
119 |
C |
p.
|
artikel
|
| 17 |
Prediction of software reliability
|
van Driel, Willem D.
|
|
|
119 |
C |
p.
|
artikel
|
| 18 |
Remaining useful life prediction in embedded systems using an online auto-updated machine learning based modeling
|
Djedidi, Oussama
|
|
|
119 |
C |
p.
|
artikel
|
| 19 |
Rolling reliability of polyurethane and polyurethane-acrylic ICAs interconnections on printed stretchable electronics
|
Fu, Zhao
|
|
|
119 |
C |
p.
|
artikel
|
| 20 |
Single-Event Latchup sensitivity: Temperature effects and the role of the collected charge
|
Guagliardo, S.
|
|
|
119 |
C |
p.
|
artikel
|
| 21 |
Study on self-heating effect and lifetime in vertical-channel field effect transistor
|
Myeong, Ilho
|
|
|
119 |
C |
p.
|
artikel
|
| 22 |
Verifying cache architecture vulnerabilities using a formal security verification flow
|
Ghasempouri, Tara
|
|
|
119 |
C |
p.
|
artikel
|
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