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                                       Details for article 11 of 22 found articles
 
 
  Effect of solder joint size and composition on liquid-assisted healing
 
 
Title: Effect of solder joint size and composition on liquid-assisted healing
Author: Siroky, Georg
Kraker, Elke
Magnien, Julien
Melinc, David
Kieslinger, Dietmar
Kozeschnik, Ernst
Ecker, Werner
Appeared in: Microelectronics reliability
Paging: Volume 119 () nr. C pages p.
Year: 2021
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 11 of 22 found articles
 
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