nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A planar capacitive sensor for 2D long-range displacement measurement
|
Yu, Jian-ping |
|
2013 |
14 |
4 |
p. 252-257 |
artikel |
2 |
A trapezoidal cantilever density sensor based on MEMS technology
|
Zhao, Li-bo |
|
2013 |
14 |
4 |
p. 274-278 |
artikel |
3 |
Electrical characterization of integrated passive devices using thin film technology for 3D integration
|
Sun, Xin |
|
2013 |
14 |
4 |
p. 235-243 |
artikel |
4 |
High-precision low-power quartz tuning fork temperature sensor with optimized resonance excitation
|
Xu, Jun |
|
2013 |
14 |
4 |
p. 264-273 |
artikel |
5 |
High Q, high frequency, high overtone bulk acoustic resonator with ZnO films
|
Liu, Meng-wei |
|
2013 |
14 |
4 |
p. 279-282 |
artikel |
6 |
Ka-band ultra low voltage miniature sub-harmonic resistive mixer with a new broadside coupled Marchand balun in 0.18-μm CMOS technology
|
Yang, Ge-liang |
|
2013 |
14 |
4 |
p. 288-295 |
artikel |
7 |
Low temperature Si/Si wafer direct bonding using a plasma activated method
|
Li, Dong-ling |
|
2013 |
14 |
4 |
p. 244-251 |
artikel |
8 |
Measurement of wireless pressure sensors fabricated in high temperature co-fired ceramic MEMS technology
|
Xiong, Ji-jun |
|
2013 |
14 |
4 |
p. 258-263 |
artikel |
9 |
Predictive current control of multi-pulse flexible-topology thyristor AC-DC converter
|
Zhang, Da-min |
|
2013 |
14 |
4 |
p. 296-310 |
artikel |
10 |
Resin-bonded NdFeB micromagnets for integration into electromagnetic vibration energy harvesters
|
Wang, Pei-hong |
|
2013 |
14 |
4 |
p. 283-287 |
artikel |