| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solderand Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish
|
Kim, Young Min
|
|
2012
|
41 |
4 |
p. 763-773
|
artikel
|
| 2 |
Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps
|
Kim, Jae-Myeong
|
|
2012
|
41 |
4 |
p. 791-799
|
artikel
|
| 3 |
Effects of Zn/Mg Ratio on the Microstructure and Microwave Dielectric Properties of (Zn1−xMgx)2SiO4 Ceramics
|
Li, Lingxia
|
|
2012
|
41 |
4 |
p. 684-688
|
artikel
|
| 4 |
Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects
|
Huang, M. L.
|
|
2012
|
41 |
4 |
p. 730-740
|
artikel
|
| 5 |
Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys
|
Tucker, J. P.
|
|
2012
|
41 |
4 |
p. 800
|
artikel
|
| 6 |
Forming-Free Reversible Bipolar Resistive Switching Behavior in Al-Doped HfO2 Metal–Insulator–Metal Devices
|
Mahapatra, R.
|
|
2012
|
41 |
4 |
p. 656-659
|
artikel
|
| 7 |
Grain Boundary Carrier Scattering in ZnO Thin Films:a Study by Temperature-Dependent Charge CarrierTransport Measurements
|
Muniswami Naidu, R.V.
|
|
2012
|
41 |
4 |
p. 660-664
|
artikel
|
| 8 |
High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films
|
Chen, Gang
|
|
2012
|
41 |
4 |
p. 782-790
|
artikel
|
| 9 |
Impedance Spectroscopy of Dielectric BaTi5O11 Film Prepared by Laser Chemical Vapor Deposition Method
|
Guo, Dongyun
|
|
2012
|
41 |
4 |
p. 689-694
|
artikel
|
| 10 |
Influence of Substrate Temperature on Structural and Thermoelectric Properties of Antimony Telluride Thin Films Fabricated by RF and DC Cosputtering
|
Chen, Tianbao
|
|
2012
|
41 |
4 |
p. 679-683
|
artikel
|
| 11 |
Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method
|
Chin, J.W.C.
|
|
2012
|
41 |
4 |
p. 774-781
|
artikel
|
| 12 |
Low-Resistance Cu-Sn Electroplated–Evaporated Microbumps for 3D Chip Stacking
|
Murugesan, M.
|
|
2012
|
41 |
4 |
p. 720-729
|
artikel
|
| 13 |
Low-Temperature Sintering and Electromagnetic Propertiesof NiCuZn/CaTiO3 Composites
|
Yang, Haibo
|
|
2012
|
41 |
4 |
p. 701-705
|
artikel
|
| 14 |
Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing
|
Shin, Hae-A-Seul
|
|
2012
|
41 |
4 |
p. 712-719
|
artikel
|
| 15 |
Microstructure, Phase Transition, and Piezoelectric Properties of Cerium-Substituted Bismuth Titanate Nanofibers
|
Jiang, Bo
|
|
2012
|
41 |
4 |
p. 651-655
|
artikel
|
| 16 |
Observations of IMC Formation for Au Wire Bonds to Al Pads
|
DeLucca, John
|
|
2012
|
41 |
4 |
p. 748-756
|
artikel
|
| 17 |
Optimization of Phase Formation and Superconducting Properties in MgB2 Prepared by Phase Transformation from MgB4
|
Tan, K. L.
|
|
2012
|
41 |
4 |
p. 673-678
|
artikel
|
| 18 |
Preparation of Ag Nanocomposite Tellurite Glass by Solid-State Field-Assisted Diffusion
|
Ma, Yan
|
|
2012
|
41 |
4 |
p. 646-650
|
artikel
|
| 19 |
Simultaneous Increases in Electrical Conductivity and Seebeck Coefficient of PEDOT:PSS Films by Adding Ionic Liquids into a Polymer Solution
|
Liu, Congcong
|
|
2012
|
41 |
4 |
p. 639-645
|
artikel
|
| 20 |
Structural, Optical, and Electrical Properties of Cobalt-Doped CdS Quantum Dots
|
Thambidurai, M.
|
|
2012
|
41 |
4 |
p. 665-672
|
artikel
|
| 21 |
Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging
|
Wang, Kai-Jheng
|
|
2012
|
41 |
4 |
p. 757-762
|
artikel
|
| 22 |
Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading
|
Zhu, Q. S.
|
|
2012
|
41 |
4 |
p. 741-747
|
artikel
|
| 23 |
Synthesis and Characterization of In2S3 Thin FilmsDeposited by Chemical Bath Deposition on Polyethylene Naphthalate Substrates
|
Castelo-González, O.A.
|
|
2012
|
41 |
4 |
p. 695-700
|
artikel
|
| 24 |
Thermomechanical Reliability Study of BenzocyclobuteneFilm in Wafer-Level Chip-Size Package
|
Lee, K.-O.
|
|
2012
|
41 |
4 |
p. 706-711
|
artikel
|
| 25 |
Transport Properties of Ni and PbTe Under Pressure
|
Jacobsen, Matthew K.
|
|
2012
|
41 |
4 |
p. 633-638
|
artikel
|
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