| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
|
Seo, Sun-Kyoung
|
|
2008
|
38 |
2 |
p. 257-265
|
artikel
|
| 2 |
Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change
|
Zamiri, A.
|
|
2008
|
38 |
2 |
p. 231-240
|
artikel
|
| 3 |
Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy
|
Mahmudi, R.
|
|
2008
|
38 |
2 |
p. 330-337
|
artikel
|
| 4 |
Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder
|
Wei, Chen
|
|
2008
|
38 |
2 |
p. 345-350
|
artikel
|
| 5 |
Foreword
|
Guo, Fu
|
|
2008
|
38 |
2 |
p. 209
|
artikel
|
| 6 |
Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders
|
Kim, Seongjun
|
|
2008
|
38 |
2 |
p. 266-272
|
artikel
|
| 7 |
Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow
|
Chen, Hsiao-Yun
|
|
2008
|
38 |
2 |
p. 338-344
|
artikel
|
| 8 |
Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies
|
Snugovsky, Polina
|
|
2008
|
38 |
2 |
p. 292-302
|
artikel
|
| 9 |
Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes
|
Zhang, Ruihong
|
|
2008
|
38 |
2 |
p. 241-251
|
artikel
|
| 10 |
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
|
Zou, Chang Dong
|
|
2008
|
38 |
2 |
p. 351-355
|
artikel
|
| 11 |
Nature of Growth Pits in Lead Salt Epilayers Grown by Molecular Beam Epitaxy
|
Ma, Jiangang
|
|
2008
|
38 |
2 |
p. 325-329
|
artikel
|
| 12 |
Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders
|
Dudek, M.A.
|
|
2008
|
38 |
2 |
p. 210-220
|
artikel
|
| 13 |
Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion
|
Chen, Xi
|
|
2008
|
38 |
2 |
p. 372-378
|
artikel
|
| 14 |
Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry
|
Wu, Y.K.
|
|
2008
|
38 |
2 |
p. 227-230
|
artikel
|
| 15 |
Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage
|
Osenbach, J.
|
|
2008
|
38 |
2 |
p. 303-324
|
artikel
|
| 16 |
Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations
|
Zhou, Wei
|
|
2008
|
38 |
2 |
p. 356-364
|
artikel
|
| 17 |
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
|
Made, Riko I
|
|
2008
|
38 |
2 |
p. 365-371
|
artikel
|
| 18 |
Temperature-Dependent Phase Segregation in Cu/42Sn-58Bi/Cu Reaction Couples under High Current Density
|
Xu, Guangchen
|
|
2008
|
38 |
2 |
p. 273-283
|
artikel
|
| 19 |
The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates
|
Wu, Albert T.
|
|
2008
|
38 |
2 |
p. 252-256
|
artikel
|
| 20 |
The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder
|
Kinney, Christopher
|
|
2008
|
38 |
2 |
p. 221-226
|
artikel
|
| 21 |
Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface
|
Zhao, Hui
|
|
2008
|
38 |
2 |
p. 284-291
|
artikel
|
Tijdschrift beschrijving