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Journal description
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Details for article 9 of 21 found articles
| Title: |
Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes |
| Author: |
Zhang, Ruihong Guo, Fu Liu, Jianping Shen, Hao Tai, Feng |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 38 (2008) nr. 2 pages 241-251 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 21 found articles
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