| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
a-Si:C:H and a-Si:N:H Thin Films Obtained by PECVD for Applications in Silicon Solar Cells
|
Stapinski, T.
|
|
2008
|
37 |
6 |
p. 905-911
|
article
|
| 2 |
Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis
|
Lai, Yi-Shao
|
|
2008
|
37 |
6 |
p. 935
|
article
|
| 3 |
Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging
|
Shih, T.I.
|
|
2008
|
37 |
6 |
p. 845-851
|
article
|
| 4 |
Diffusion-Reaction in the Au-Rich Ternary Au-Pt-Sn System as a Basis for Ternary Diffusion Soldering
|
Grolier, Vincent
|
|
2008
|
37 |
6 |
p. 815-828
|
article
|
| 5 |
Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints
|
Chen, Min-Na
|
|
2008
|
37 |
6 |
p. 894-900
|
article
|
| 6 |
Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy
|
Liu, Ping
|
|
2008
|
37 |
6 |
p. 874-879
|
article
|
| 7 |
Electrical Conductivity, Thermoelectric Power, and Optical Properties of Organo-Soluble Polyaniline Organic Semiconductor
|
Yakuphanoglu, Fahrettin
|
|
2008
|
37 |
6 |
p. 930-934
|
article
|
| 8 |
Electromigration of Sn-9wt.%Zn Solder
|
Hung, Yu-Min
|
|
2008
|
37 |
6 |
p. 887-893
|
article
|
| 9 |
Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films
|
Hsu, C.S.
|
|
2008
|
37 |
6 |
p. 852-859
|
article
|
| 10 |
Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route
|
Babaghorbani, P.
|
|
2008
|
37 |
6 |
p. 860-866
|
article
|
| 11 |
Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders
|
Tang, Wenming
|
|
2008
|
37 |
6 |
p. 837-844
|
article
|
| 12 |
Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations
|
Vuorinen, V.
|
|
2008
|
37 |
6 |
p. 792-805
|
article
|
| 13 |
Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability
|
Xu, Luhua
|
|
2008
|
37 |
6 |
p. 880-886
|
article
|
| 14 |
Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound
|
Kumamoto, Seishi
|
|
2008
|
37 |
6 |
p. 806-814
|
article
|
| 15 |
Magneto-transport Properties of a GaMnAs-Based Ferromagnetic Semiconductor Trilayer Structure Grown on a ZnMnSe Buffer
|
Chung, S.J.
|
|
2008
|
37 |
6 |
p. 912-916
|
article
|
| 16 |
Novel Cu/Cr/Ge/Pd Ohmic Contacts on Highly Doped n-GaAs
|
Sahoo, Kartika Chandra
|
|
2008
|
37 |
6 |
p. 901-904
|
article
|
| 17 |
Preparation and Characterization of Polyimide/Zirconia Composite Films
|
Wang, Sea-Fue
|
|
2008
|
37 |
6 |
p. 925-929
|
article
|
| 18 |
Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures
|
Park, T.-S.
|
|
2008
|
37 |
6 |
p. 777-791
|
article
|
| 19 |
Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling
|
Wong, E.H.
|
|
2008
|
37 |
6 |
p. 829-836
|
article
|
| 20 |
Structural and Chemical Comparison of Graphite and BN/AlN Caps Used for Annealing Ion Implanted SiC
|
Jones, K.A.
|
|
2008
|
37 |
6 |
p. 917-924
|
article
|
| 21 |
The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM
|
Lee, Hwa-Teng
|
|
2008
|
37 |
6 |
p. 867-873
|
article
|
Journal description