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Journal description
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Details for article 14 of 21 found articles
| Title: |
Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound |
| Author: |
Kumamoto, Seishi Sakurai, Hitoshi Kukimoto, Youichi Suganuma, Katsuaki |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2008) nr. 6 pages 806-814 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 21 found articles
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