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                                       Details for article 5 of 21 found articles
 
 
  Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints
 
 
Title: Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints
Author: Chen, Min-Na
Ding, Shi-Jin
Sun, Qing-Qing
Zhang, David Wei
Wang, Li-Kang
Appeared in: Journal of electronic materials
Paging: Volume 37 (2008) nr. 6 pages 894-900
Year: 2008
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 21 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands