| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering
|
Seo, Sun-Kyoung
|
|
|
35 |
11 |
p. 1975-1981
|
artikel
|
| 2 |
Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering
|
Seo, Sun-Kyoung
|
|
2006
|
35 |
11 |
p. 1975-1981
|
artikel
|
| 3 |
Development of a high-strength high-conductivity Cu−Ni−P alloy. Part II: Processing by severe deformation
|
Belyakov, A.
|
|
|
35 |
11 |
p. 2000-2008
|
artikel
|
| 4 |
Development of a high-strength high-conductivity Cu−Ni−P alloy. Part II: Processing by severe deformation
|
Belyakov, A.
|
|
2006
|
35 |
11 |
p. 2000-2008
|
artikel
|
| 5 |
Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction
|
Takaku, Yoshikazu
|
|
|
35 |
11 |
p. 1926-1932
|
artikel
|
| 6 |
Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction
|
Takaku, Yoshikazu
|
|
2006
|
35 |
11 |
p. 1926-1932
|
artikel
|
| 7 |
Effect of glass frit chemistry on the physical and electrical properties of thick-film Ag contacts for silicon solar cells
|
Hilali, Mohamed M.
|
|
2006
|
35 |
11 |
p. 2041-2047
|
artikel
|
| 8 |
Effect of settlement on dense slurry flow in a horizontal channel
|
Yang, R.
|
|
2006
|
35 |
11 |
p. 2026-2034
|
artikel
|
| 9 |
Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
|
Gam, Sang-Ah
|
|
2006
|
35 |
11 |
p. 2048-2055
|
artikel
|
| 10 |
Electromigration effects on intermetallic growth at wire-bond interfaces
|
Orchard, H. T.
|
|
|
35 |
11 |
p. 1961-1968
|
artikel
|
| 11 |
Electromigration effects on intermetallic growth at wire-bond interfaces
|
Orchard, H. T.
|
|
2006
|
35 |
11 |
p. 1961-1968
|
artikel
|
| 12 |
elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging
|
Jang, Guh-Yaw
|
|
|
35 |
11 |
p. 2061-2070
|
artikel
|
| 13 |
elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging
|
Jang, Guh-Yaw
|
|
2006
|
35 |
11 |
p. 2061-2070
|
artikel
|
| 14 |
Foreword
|
Suganuma, Katsuaki
|
|
2006
|
35 |
11 |
p. 1917
|
artikel
|
| 15 |
High dielectric constant polymer-ceramic (Epoxy varnish-barium titanate) nanocomposites at moderate filler loadings for embedded capacitors
|
Xu, Jianwen
|
|
2006
|
35 |
11 |
p. 2009-2015
|
artikel
|
| 16 |
in-situ electromigration study on Sn−Ag−Cu solder joint by digital image speckle analysis
|
Xu, Luhua
|
|
2006
|
35 |
11 |
p. 1993-1999
|
artikel
|
| 17 |
Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls
|
Chen, Chih-Ming
|
|
2006
|
35 |
11 |
p. 1937-1947
|
artikel
|
| 18 |
Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls
|
Chen, Chih-Ming
|
|
|
35 |
11 |
p. 1937-1947
|
artikel
|
| 19 |
Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures
|
Wang, S. J.
|
|
2006
|
35 |
11 |
p. 1955-1960
|
artikel
|
| 20 |
Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures
|
Wang, S. J.
|
|
|
35 |
11 |
p. 1955-1960
|
artikel
|
| 21 |
Kinetics of AuSn4 migration in lead-free solders
|
Chang, C. W.
|
|
|
35 |
11 |
p. 1948-1954
|
artikel
|
| 22 |
Kinetics of AuSn4 migration in lead-free solders
|
Chang, C. W.
|
|
2006
|
35 |
11 |
p. 1948-1954
|
artikel
|
| 23 |
Lowering of Sn−Sb alloy melting points caused by substrate dissolution
|
Chen, Sinn-Wen
|
|
2006
|
35 |
11 |
p. 1982-1985
|
artikel
|
| 24 |
Metal-semiconductor amorphous and nanoscale Ge-phase composites produced by rapid solidification and by devitrification of an amorphous matrix
|
Louzguine-Luzgin, D. V.
|
|
2006
|
35 |
11 |
p. 1986-1992
|
artikel
|
| 25 |
Metal-semiconductor amorphous and nanoscale Ge-phase composites produced by rapid solidification and by devitrification of an amorphous matrix
|
Louzguine-Luzgin, D. V.
|
|
|
35 |
11 |
p. 1986-1992
|
artikel
|
| 26 |
Model of shear viscosity for underfill flows
|
Yang, R.
|
|
2006
|
35 |
11 |
p. 2016-2025
|
artikel
|
| 27 |
Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu soldring using the phase-field method
|
Ode, Machiko
|
|
|
35 |
11 |
p. 1969-1974
|
artikel
|
| 28 |
Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu soldring using the phase-field method
|
Ode, Machiko
|
|
2006
|
35 |
11 |
p. 1969-1974
|
artikel
|
| 29 |
Realization of very long wavelength infrared photovoltaic detector arrays on mercury cadmium telluride epitaxial layers grown on Si substrates
|
Gupta, S.
|
|
|
35 |
11 |
p. 2056-2060
|
artikel
|
| 30 |
Realization of very long wavelength infrared photovoltaic detector arrays on mercury cadmium telluride epitaxial layers grown on Si substrates
|
Gupta, S.
|
|
2006
|
35 |
11 |
p. 2056-2060
|
artikel
|
| 31 |
Suppression of tin whisker formation on fine pitch connectors by surface roughening
|
Takeuchi, Makoto
|
|
2006
|
35 |
11 |
p. 1918-1925
|
artikel
|
| 32 |
Thermally stable Ge/Cu/Ti ohmic contacts to n-type GaN
|
Mahadik, Nadeemullah
|
|
2006
|
35 |
11 |
p. 2035-2040
|
artikel
|
| 33 |
Thermal stability of Cu(W) and Cu(Mo) films for advanced barrierless Cu metallization: Effects of annealing time
|
Chu, J. P.
|
|
2006
|
35 |
11 |
p. 1933-1936
|
artikel
|
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