| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique
|
Choi, W. K.
|
|
2002
|
31 |
11 |
p. 1283-1291
|
artikel
|
| 2 |
Damage accumulation under repeated reverse stressing of Sn-Ag solder joints
|
Chen, K. C.
|
|
2002
|
31 |
11 |
p. 1181-1189
|
artikel
|
| 3 |
Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys
|
Cook, B. A.
|
|
2002
|
31 |
11 |
p. 1190-1194
|
artikel
|
| 4 |
Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system
|
Liu, X. J.
|
|
2002
|
31 |
11 |
p. 1139-1151
|
artikel
|
| 5 |
Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment
|
Lalena, John N.
|
|
2002
|
31 |
11 |
p. 1244-1249
|
artikel
|
| 6 |
Failure mechanism of lead-free solder joints in flip chip packages
|
Zhang, Fan
|
|
2002
|
31 |
11 |
p. 1256-1263
|
artikel
|
| 7 |
Foreword
|
Chada, Srinivas
|
|
2002
|
31 |
11 |
p. 1129
|
artikel
|
| 8 |
High creep resistance tin-based alloys for soldering applications
|
Mccabe, Rodney J.
|
|
2002
|
31 |
11 |
p. 1276-1282
|
artikel
|
| 9 |
Inhibiting the formation of (Au1−xNix)Sn4 and reducing the consumption of Ni metallization in solder joints
|
Ho, C. E.
|
|
2002
|
31 |
11 |
p. 1264-1269
|
artikel
|
| 10 |
Interfacial microstructure of Pb-free and Pb-Sn solder balls in the ball-grid array package
|
Chi, Chin-Su
|
|
2002
|
31 |
11 |
p. 1203-1207
|
artikel
|
| 11 |
Isothermal solidification of Cu/Sn diffusion couples to form thin-solder joints
|
Kang, J. S.
|
|
2002
|
31 |
11 |
p. 1238-1243
|
artikel
|
| 12 |
Lead-free ball-grid array balls: Production method and properties
|
Kempf, B.
|
|
2002
|
31 |
11 |
p. 1270-1275
|
artikel
|
| 13 |
Lead-free universal solders for optical and electronic devices
|
Mavoori, Hareesh
|
|
2002
|
31 |
11 |
p. 1160-1165
|
artikel
|
| 14 |
Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying
|
Anderson, I. E.
|
|
2002
|
31 |
11 |
p. 1166-1174
|
artikel
|
| 15 |
Microstructure of a lead-free composite solder produced by an in-situ process
|
Hwang, Seong-Yong
|
|
2002
|
31 |
11 |
p. 1304-1308
|
artikel
|
| 16 |
Modeling thermomechanical fatigue behavior of Sn-Ag solder joints
|
Lee, J. G.
|
|
2002
|
31 |
11 |
p. 1152-1159
|
artikel
|
| 17 |
Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate
|
Gagliano, R. A.
|
|
|
31 |
11 |
p. 1195-1202
|
artikel
|
| 18 |
Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate
|
Gagliano, R. A.
|
|
2002
|
31 |
11 |
p. 1195-1202
|
artikel
|
| 19 |
Phenomena of electroless Ni-P and intermetallic-compound stripping and dissolving in Sn-Bi and Sn-Pb solder joints with Au/EN/Cu metallization
|
Huang, Chien-Sheng
|
|
2002
|
31 |
11 |
p. 1230-1237
|
artikel
|
| 20 |
Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages
|
Park, Jong-Hwan
|
|
2002
|
31 |
11 |
p. 1175-1180
|
artikel
|
| 21 |
Solder balling of lead-free solder pastes
|
Arra, Minna
|
|
2002
|
31 |
11 |
p. 1130-1138
|
artikel
|
| 22 |
Studies of the mechanical and electrical properties of lead-free solder joints
|
Kang, S. K.
|
|
2002
|
31 |
11 |
p. 1292-1303
|
artikel
|
| 23 |
Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions
|
Moser, Z.
|
|
2002
|
31 |
11 |
p. 1225-1229
|
artikel
|
| 24 |
Textured growth of Cu/Sn intermetallic compounds
|
Prakash, K. H.
|
|
2002
|
31 |
11 |
p. 1250-1255
|
artikel
|
| 25 |
The effect of flux chemistry, applied voltage, conductor spacing, and temperature on conductive anodic filament formation
|
Ready, W. J.
|
|
|
31 |
11 |
p. 1208-1224
|
artikel
|
| 26 |
The effect of flux chemistry, applied voltage, conductor spacing, and temperature on conductive anodic filament formation
|
Ready, W. J.
|
|
2002
|
31 |
11 |
p. 1208-1224
|
artikel
|
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