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Journal description
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Details for article 2 of 26 found articles
| Title: |
Damage accumulation under repeated reverse stressing of Sn-Ag solder joints |
| Author: |
Chen, K. C. Telang, A. Lee, J. G. Subramanian, K. N. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 31 (2002) nr. 11 pages 1181-1189 |
| Year: |
2002 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 26 found articles
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