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                             67 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 An evaluation of the voltage-current rating characteristics of miniature monolithic RF ceramic capacitors
11 4 p. 39
artikel
2 A new electroless method for low-loss microwave integrated circuits
11 4 p. 39
artikel
3 A realistic approach to thick film resistor design
11 4 p. 38
artikel
4 A small scale silicon epitaxial film deposition system
11 4 p. 41
artikel
5 Automatic alignment for direct step and repeat printing on silicon
11 4 p. 41
artikel
6 Book review Free, C.

11 4 p. 43
artikel
7 Book review Manden, A.F.

11 4 p. 44
artikel
8 Book review Weatherley, R.T.

11 4 p. 44
artikel
9 Book review Anand, K.V.

11 4 p. 43
artikel
10 Book review Weatherley, R.T.

11 4 p. 44
artikel
11 Characteristics of an indium-tin oxide transparent conductor deposited from organometallic compositions
11 4 p. 40
artikel
12 Characterization and morphology of chemical vapour deposition of silicon
11 4 p. 42
artikel
13 Chip-module package interfaces
11 4 p. 38
artikel
14 C-MOS on sapphire sparks small computer's performance
11 4 p. 42
artikel
15 Conduction properties of lightly doped, polycrystalline silicon
11 4 p. 41-42
artikel
16 Contact noise in thick film resistors
11 4 p. 41
artikel
17 Control of pre-trim variables in thick film resistor processing
11 4 p. 40-41
artikel
18 Design of wide band amplifiers using hybrid integrated techniques
11 4 p. 37
artikel
19 Determination of surface state distribution from pulsed MOS capacitor transients
11 4 p. 39
artikel
20 Editorial Butcher, John

11 4 p. 3
artikel
21 Effect of reactive gas dopants on the MgP surface in AC plasma display panels
11 4 p. 39-40
artikel
22 Elastic and inelastic scattering of electrons by vibrating impurities in semiconductors
11 4 p. 41
artikel
23 Electrical conduction in thin zinc rf sputtered films
11 4 p. 39
artikel
24 Electrical properties of the MIS capacitor under illumination
11 4 p. 38
artikel
25 Epoxies for component mounting in thick film hybrids
11 4 p. 40
artikel
26 Evaluation of adhesives for hybrid microcircuit package sealing
11 4 p. 40
artikel
27 Extreme temperature range microelectronics
11 4 p. 42
artikel
28 Ferromagnetic resonance in strained and strain-free single crystal nickel films
11 4 p. 39
artikel
29 Flicker noise in MOSFETs made by the DMOS process
11 4 p. 40
artikel
30 Frequency dependent propagation delay in silicon-on-sapphire digital integrated circuits
11 4 p. 37
artikel
31 Gang bonding to standard aluminized integrated circuits with bumped interconnect tape
11 4 p. 41
artikel
32 Hall effect measurements of flash evaporated cadmium sulphide thin films
11 4 p. 40
artikel
33 High density raises sights of ECL design
11 4 p. 42
artikel
34 High speed functional testing of microprocessor based boards Skingley, D.A.

11 4 p. 31-33
artikel
35 Infrared high spatial-resolution determination of doping levels in p-n junctions
11 4 p. 41
artikel
36 Laser drilling of vias in dielectric for high density multilayer thick film circuits
11 4 p. 40
artikel
37 Lead forming and outer lead bond pattern design for tape-bonded hybrids
11 4 p. 38
artikel
38 Measurement of the lattice constant of Si-Ge hetero-epitaxial layers grown on a silicon substrate
11 4 p. 42
artikel
39 Microelectronics on the road to VLSI technique. Part 1: Procedural steps
11 4 p. 40
artikel
40 Molecular beam epitaxy
11 4 p. 40
artikel
41 New gallium arsenide oxidation technique for microwave integrated circuits
11 4 p. 37
artikel
42 New substrate causes a stir
11 4 p. 39
artikel
43 Non uniform recombination in thin silicon-on-sapphire films
11 4 p. 39
artikel
44 Numerical analysis of electric semiconductor structures
11 4 p. 41
artikel
45 Observations of dislocations and junction irregularities in bipolar transistors using the E.B.I.C. mode of the scanning electron microscope
11 4 p. 42
artikel
46 On the control of MOSFET threshold voltage variation for the production of LSI devices Maddox, R.L.

11 4 p. 4-19
artikel
47 Photocurrents in silicon nitride films
11 4 p. 39
artikel
48 64-pin QUIP keeps microprocessor chips cool and accessible
11 4 p. 38
artikel
49 Practical troubleshooting of vacuum deposition processes and equipment for aluminum metalization
11 4 p. 41
artikel
50 Process oriented simulation of integrated transistors Antognetti, P.

11 4 p. 20-23
artikel
51 Radiation-hardened CMOS integrated circuits Pikor, A.

11 4 p. 27-30
artikel
52 Reactive sputter etching of thin films for pattern delincation
11 4 p. 38
artikel
53 Reducing post-trim drift of thin-film resistors by optimizing YAG laser output characteristics
11 4 p. 39
artikel
54 Resistor grids in hybrid circuits Bapeswara Rao, V.V.

11 4 p. 24-26
artikel
55 Scanning photocurrent microscopy: A new technique to study inhomogeneously distributed recombination centers in semiconductors
11 4 p. 42
artikel
56 The design of microcomputer systems
11 4 p. 37
artikel
57 The kinetics of open tube phosphorus diffusion in silicon
11 4 p. 41
artikel
58 The microprocessor in video editing
11 4 p. 42
artikel
59 The preparation, structure and properties of Pb0.82Sn0.18 Te films obtained by modified hot-wall evaporation technique
11 4 p. 39
artikel
60 Thermal oxidation of silicon using trichloroethylene
11 4 p. 40
artikel
61 Thermocompression bondability of bare copper leads
11 4 p. 38
artikel
62 Thick film distributed notch filters
11 4 p. 38
artikel
63 Thin-film layers shrink rf inductors to chip size
11 4 p. 38
artikel
64 Thinning method for electron microscopy transparent silicon and germanium foils
11 4 p. 41
artikel
65 Time dependence of ion-migration effects in NiCr resistor films
11 4 p. 38
artikel
66 Tunable infra-red semiconductor diode lasers Gibson, J.A.

11 4 p. 34-36
artikel
67 Use of microprocessors in multiple-processor systems
11 4 p. 42
artikel
                             67 gevonden resultaten
 
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