| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
An evaluation of the voltage-current rating characteristics of miniature monolithic RF ceramic capacitors
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 2 |
A new electroless method for low-loss microwave integrated circuits
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 3 |
A realistic approach to thick film resistor design
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 4 |
A small scale silicon epitaxial film deposition system
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 5 |
Automatic alignment for direct step and repeat printing on silicon
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 6 |
Book review
|
Free, C.
|
|
|
11 |
4 |
p. 43
|
article
|
| 7 |
Book review
|
Manden, A.F.
|
|
|
11 |
4 |
p. 44
|
article
|
| 8 |
Book review
|
Weatherley, R.T.
|
|
|
11 |
4 |
p. 44
|
article
|
| 9 |
Book review
|
Anand, K.V.
|
|
|
11 |
4 |
p. 43
|
article
|
| 10 |
Book review
|
Weatherley, R.T.
|
|
|
11 |
4 |
p. 44
|
article
|
| 11 |
Characteristics of an indium-tin oxide transparent conductor deposited from organometallic compositions
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 12 |
Characterization and morphology of chemical vapour deposition of silicon
|
|
|
|
11 |
4 |
p. 42
|
article
|
| 13 |
Chip-module package interfaces
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 14 |
C-MOS on sapphire sparks small computer's performance
|
|
|
|
11 |
4 |
p. 42
|
article
|
| 15 |
Conduction properties of lightly doped, polycrystalline silicon
|
|
|
|
11 |
4 |
p. 41-42
|
article
|
| 16 |
Contact noise in thick film resistors
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 17 |
Control of pre-trim variables in thick film resistor processing
|
|
|
|
11 |
4 |
p. 40-41
|
article
|
| 18 |
Design of wide band amplifiers using hybrid integrated techniques
|
|
|
|
11 |
4 |
p. 37
|
article
|
| 19 |
Determination of surface state distribution from pulsed MOS capacitor transients
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 20 |
Editorial
|
Butcher, John
|
|
|
11 |
4 |
p. 3
|
article
|
| 21 |
Effect of reactive gas dopants on the MgP surface in AC plasma display panels
|
|
|
|
11 |
4 |
p. 39-40
|
article
|
| 22 |
Elastic and inelastic scattering of electrons by vibrating impurities in semiconductors
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 23 |
Electrical conduction in thin zinc rf sputtered films
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 24 |
Electrical properties of the MIS capacitor under illumination
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 25 |
Epoxies for component mounting in thick film hybrids
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 26 |
Evaluation of adhesives for hybrid microcircuit package sealing
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 27 |
Extreme temperature range microelectronics
|
|
|
|
11 |
4 |
p. 42
|
article
|
| 28 |
Ferromagnetic resonance in strained and strain-free single crystal nickel films
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 29 |
Flicker noise in MOSFETs made by the DMOS process
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 30 |
Frequency dependent propagation delay in silicon-on-sapphire digital integrated circuits
|
|
|
|
11 |
4 |
p. 37
|
article
|
| 31 |
Gang bonding to standard aluminized integrated circuits with bumped interconnect tape
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 32 |
Hall effect measurements of flash evaporated cadmium sulphide thin films
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 33 |
High density raises sights of ECL design
|
|
|
|
11 |
4 |
p. 42
|
article
|
| 34 |
High speed functional testing of microprocessor based boards
|
Skingley, D.A.
|
|
|
11 |
4 |
p. 31-33
|
article
|
| 35 |
Infrared high spatial-resolution determination of doping levels in p-n junctions
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 36 |
Laser drilling of vias in dielectric for high density multilayer thick film circuits
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 37 |
Lead forming and outer lead bond pattern design for tape-bonded hybrids
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 38 |
Measurement of the lattice constant of Si-Ge hetero-epitaxial layers grown on a silicon substrate
|
|
|
|
11 |
4 |
p. 42
|
article
|
| 39 |
Microelectronics on the road to VLSI technique. Part 1: Procedural steps
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 40 |
Molecular beam epitaxy
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 41 |
New gallium arsenide oxidation technique for microwave integrated circuits
|
|
|
|
11 |
4 |
p. 37
|
article
|
| 42 |
New substrate causes a stir
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 43 |
Non uniform recombination in thin silicon-on-sapphire films
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 44 |
Numerical analysis of electric semiconductor structures
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 45 |
Observations of dislocations and junction irregularities in bipolar transistors using the E.B.I.C. mode of the scanning electron microscope
|
|
|
|
11 |
4 |
p. 42
|
article
|
| 46 |
On the control of MOSFET threshold voltage variation for the production of LSI devices
|
Maddox, R.L.
|
|
|
11 |
4 |
p. 4-19
|
article
|
| 47 |
Photocurrents in silicon nitride films
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 48 |
64-pin QUIP keeps microprocessor chips cool and accessible
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 49 |
Practical troubleshooting of vacuum deposition processes and equipment for aluminum metalization
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 50 |
Process oriented simulation of integrated transistors
|
Antognetti, P.
|
|
|
11 |
4 |
p. 20-23
|
article
|
| 51 |
Radiation-hardened CMOS integrated circuits
|
Pikor, A.
|
|
|
11 |
4 |
p. 27-30
|
article
|
| 52 |
Reactive sputter etching of thin films for pattern delincation
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 53 |
Reducing post-trim drift of thin-film resistors by optimizing YAG laser output characteristics
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 54 |
Resistor grids in hybrid circuits
|
Bapeswara Rao, V.V.
|
|
|
11 |
4 |
p. 24-26
|
article
|
| 55 |
Scanning photocurrent microscopy: A new technique to study inhomogeneously distributed recombination centers in semiconductors
|
|
|
|
11 |
4 |
p. 42
|
article
|
| 56 |
The design of microcomputer systems
|
|
|
|
11 |
4 |
p. 37
|
article
|
| 57 |
The kinetics of open tube phosphorus diffusion in silicon
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 58 |
The microprocessor in video editing
|
|
|
|
11 |
4 |
p. 42
|
article
|
| 59 |
The preparation, structure and properties of Pb0.82Sn0.18 Te films obtained by modified hot-wall evaporation technique
|
|
|
|
11 |
4 |
p. 39
|
article
|
| 60 |
Thermal oxidation of silicon using trichloroethylene
|
|
|
|
11 |
4 |
p. 40
|
article
|
| 61 |
Thermocompression bondability of bare copper leads
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 62 |
Thick film distributed notch filters
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 63 |
Thin-film layers shrink rf inductors to chip size
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 64 |
Thinning method for electron microscopy transparent silicon and germanium foils
|
|
|
|
11 |
4 |
p. 41
|
article
|
| 65 |
Time dependence of ion-migration effects in NiCr resistor films
|
|
|
|
11 |
4 |
p. 38
|
article
|
| 66 |
Tunable infra-red semiconductor diode lasers
|
Gibson, J.A.
|
|
|
11 |
4 |
p. 34-36
|
article
|
| 67 |
Use of microprocessors in multiple-processor systems
|
|
|
|
11 |
4 |
p. 42
|
article
|
Journal description