nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes
|
Borgesen, P. |
|
2019 |
95 |
C |
p. 65-73 |
artikel |
2 |
Comparison of fatigue life prediction methods for solder joints under random vibration loading
|
Xia, Jiang |
|
2019 |
95 |
C |
p. 58-64 |
artikel |
3 |
Dual-axis rotary platform with UAV image recognition and tracking
|
Sheu, Bor-Horng |
|
2019 |
95 |
C |
p. 8-17 |
artikel |
4 |
Early SEU sensitivity assessment for collaborative hardening techniques: A case study of OPTOS processing architecture
|
Martín-Ortega, Alberto |
|
2019 |
95 |
C |
p. 36-47 |
artikel |
5 |
Editorial Board
|
|
|
2019 |
95 |
C |
p. ii |
artikel |
6 |
Effects of total ionizing dose on single event effect sensitivity of FRAMs
|
Ji, Qinggang |
|
2019 |
95 |
C |
p. 1-7 |
artikel |
7 |
Lateral charge spreading and device-to-device coupling in C-doped AlGaN/GaN-on-Si wafers
|
Singh, Manikant |
|
2019 |
95 |
C |
p. 81-86 |
artikel |
8 |
Numerical study on the self-heating effects for vacuum/high-k gate dielectric tri-gate FinFETs
|
Zhang, Guohe |
|
2019 |
95 |
C |
p. 52-57 |
artikel |
9 |
Phase formation and microstructure evolution in Cu/In/Cu joints
|
Chiu, Y.S. |
|
2019 |
95 |
C |
p. 18-27 |
artikel |
10 |
Reliability and lifetime estimations of GaN-on-GaN vertical pn diodes
|
Rackauskas, B. |
|
2019 |
95 |
C |
p. 48-51 |
artikel |
11 |
Reliability of 3D memories using Orthogonal Latin Square codes
|
Sánchez-Macián, A. |
|
2019 |
95 |
C |
p. 74-80 |
artikel |
12 |
Simulation of substrate contact effects on heavy ion-induced current transient in SiGe HBT
|
Wei, Jia-nan |
|
2019 |
95 |
C |
p. 28-35 |
artikel |