| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes
|
Borgesen, P.
|
|
2019
|
95 |
C |
p. 65-73
|
article
|
| 2 |
Comparison of fatigue life prediction methods for solder joints under random vibration loading
|
Xia, Jiang
|
|
2019
|
95 |
C |
p. 58-64
|
article
|
| 3 |
Dual-axis rotary platform with UAV image recognition and tracking
|
Sheu, Bor-Horng
|
|
2019
|
95 |
C |
p. 8-17
|
article
|
| 4 |
Early SEU sensitivity assessment for collaborative hardening techniques: A case study of OPTOS processing architecture
|
Martín-Ortega, Alberto
|
|
2019
|
95 |
C |
p. 36-47
|
article
|
| 5 |
Editorial Board
|
|
|
2019
|
95 |
C |
p. ii
|
article
|
| 6 |
Effects of total ionizing dose on single event effect sensitivity of FRAMs
|
Ji, Qinggang
|
|
2019
|
95 |
C |
p. 1-7
|
article
|
| 7 |
Lateral charge spreading and device-to-device coupling in C-doped AlGaN/GaN-on-Si wafers
|
Singh, Manikant
|
|
2019
|
95 |
C |
p. 81-86
|
article
|
| 8 |
Numerical study on the self-heating effects for vacuum/high-k gate dielectric tri-gate FinFETs
|
Zhang, Guohe
|
|
2019
|
95 |
C |
p. 52-57
|
article
|
| 9 |
Phase formation and microstructure evolution in Cu/In/Cu joints
|
Chiu, Y.S.
|
|
2019
|
95 |
C |
p. 18-27
|
article
|
| 10 |
Reliability and lifetime estimations of GaN-on-GaN vertical pn diodes
|
Rackauskas, B.
|
|
2019
|
95 |
C |
p. 48-51
|
article
|
| 11 |
Reliability of 3D memories using Orthogonal Latin Square codes
|
Sánchez-Macián, A.
|
|
2019
|
95 |
C |
p. 74-80
|
article
|
| 12 |
Simulation of substrate contact effects on heavy ion-induced current transient in SiGe HBT
|
Wei, Jia-nan
|
|
2019
|
95 |
C |
p. 28-35
|
article
|
Journal description