nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Aging comparative analysis of high-performance FinFET and CMOS flip-flops
|
Taghipour, Shiva |
|
2017 |
69 |
C |
p. 52-59 8 p. |
artikel |
2 |
A modified boost rectifier for elimination of circulating current in power factor correction applications
|
Venkitusamy, Karthikeyan |
|
2017 |
69 |
C |
p. 29-35 7 p. |
artikel |
3 |
An alternative approach to measure alpha-particle-induced SEU cross-section for flip-chip packaged SRAM devices: High energy alpha backside irradiation
|
Khan, Saqib Ali |
|
2017 |
69 |
C |
p. 100-108 9 p. |
artikel |
4 |
An enhanced MOSFET threshold voltage model for the 6–300K temperature range
|
Dao, Nguyen Cong |
|
2017 |
69 |
C |
p. 36-39 4 p. |
artikel |
5 |
A perspective of the IPC report on lead-free electronics in military/aerospace applications
|
Fortier, Aleksandra |
|
2017 |
69 |
C |
p. 66-70 5 p. |
artikel |
6 |
A review of DC extraction methods for MOSFET series resistance and mobility degradation model parameters
|
Ortiz-Conde, Adelmo |
|
2017 |
69 |
C |
p. 1-16 16 p. |
artikel |
7 |
Comments on “Extend orthogonal Latin square codes for 32-bit data protection in memory applications” Microelectron. Reliab. 63, 278–283 (2016)
|
Liu, Shanshan |
|
2017 |
69 |
C |
p. 126-129 4 p. |
artikel |
8 |
Development and application of the Oxide Stress Separation technique for the measurement of ONO leakage currents at low electric fields in 40nm floating gate embedded-flash memory
|
Dobri, Adam |
|
2017 |
69 |
C |
p. 47-51 5 p. |
artikel |
9 |
Editorial Board
|
|
|
2017 |
69 |
C |
p. IFC- 1 p. |
artikel |
10 |
Effects of finger dimension on low-frequency noise and optoelectronic properties of Ge metal-semiconductor-metal photodetectors with interdigitated Pt finger electrodes
|
Zumuukhorol, Munkhsaikhan |
|
2017 |
69 |
C |
p. 60-65 6 p. |
artikel |
11 |
Effects of temperature and span amplitude on fretting corrosion behavior of tin-plated electrical contacts
|
Kim, Min-Jung |
|
2017 |
69 |
C |
p. 80-87 8 p. |
artikel |
12 |
Emulation-based fault analysis on RFID tags for robustness and security evaluation
|
Mezzah, Ibrahim |
|
2017 |
69 |
C |
p. 115-125 11 p. |
artikel |
13 |
Optimization of the thermal contact resistance within press pack IGBTs
|
Deng, Erping |
|
2017 |
69 |
C |
p. 17-28 12 p. |
artikel |
14 |
Semiconductor package qualification based on the swelling temperature
|
Song, K.H. |
|
2017 |
69 |
C |
p. 71-79 9 p. |
artikel |
15 |
Single event double node upset tolerance in MOS/spintronic sequential and combinational logic circuits
|
Rajaei, Ramin |
|
2017 |
69 |
C |
p. 109-114 6 p. |
artikel |
16 |
Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device
|
Lee, Hosung |
|
2017 |
69 |
C |
p. 88-99 12 p. |
artikel |
17 |
The role of electronic energy loss in SHI irradiated Ni/oxide/n-GaP Schottky diode
|
Shiwakoti, N. |
|
2017 |
69 |
C |
p. 40-46 7 p. |
artikel |