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                             17 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Aging comparative analysis of high-performance FinFET and CMOS flip-flops Taghipour, Shiva
2017
69 C p. 52-59
8 p.
artikel
2 A modified boost rectifier for elimination of circulating current in power factor correction applications Venkitusamy, Karthikeyan
2017
69 C p. 29-35
7 p.
artikel
3 An alternative approach to measure alpha-particle-induced SEU cross-section for flip-chip packaged SRAM devices: High energy alpha backside irradiation Khan, Saqib Ali
2017
69 C p. 100-108
9 p.
artikel
4 An enhanced MOSFET threshold voltage model for the 6–300K temperature range Dao, Nguyen Cong
2017
69 C p. 36-39
4 p.
artikel
5 A perspective of the IPC report on lead-free electronics in military/aerospace applications Fortier, Aleksandra
2017
69 C p. 66-70
5 p.
artikel
6 A review of DC extraction methods for MOSFET series resistance and mobility degradation model parameters Ortiz-Conde, Adelmo
2017
69 C p. 1-16
16 p.
artikel
7 Comments on “Extend orthogonal Latin square codes for 32-bit data protection in memory applications” Microelectron. Reliab. 63, 278–283 (2016) Liu, Shanshan
2017
69 C p. 126-129
4 p.
artikel
8 Development and application of the Oxide Stress Separation technique for the measurement of ONO leakage currents at low electric fields in 40nm floating gate embedded-flash memory Dobri, Adam
2017
69 C p. 47-51
5 p.
artikel
9 Editorial Board 2017
69 C p. IFC-
1 p.
artikel
10 Effects of finger dimension on low-frequency noise and optoelectronic properties of Ge metal-semiconductor-metal photodetectors with interdigitated Pt finger electrodes Zumuukhorol, Munkhsaikhan
2017
69 C p. 60-65
6 p.
artikel
11 Effects of temperature and span amplitude on fretting corrosion behavior of tin-plated electrical contacts Kim, Min-Jung
2017
69 C p. 80-87
8 p.
artikel
12 Emulation-based fault analysis on RFID tags for robustness and security evaluation Mezzah, Ibrahim
2017
69 C p. 115-125
11 p.
artikel
13 Optimization of the thermal contact resistance within press pack IGBTs Deng, Erping
2017
69 C p. 17-28
12 p.
artikel
14 Semiconductor package qualification based on the swelling temperature Song, K.H.
2017
69 C p. 71-79
9 p.
artikel
15 Single event double node upset tolerance in MOS/spintronic sequential and combinational logic circuits Rajaei, Ramin
2017
69 C p. 109-114
6 p.
artikel
16 Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device Lee, Hosung
2017
69 C p. 88-99
12 p.
artikel
17 The role of electronic energy loss in SHI irradiated Ni/oxide/n-GaP Schottky diode Shiwakoti, N.
2017
69 C p. 40-46
7 p.
artikel
                             17 gevonden resultaten
 
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