| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A hybrid prognostics approach for MEMS: From real measurements to remaining useful life estimation
|
Skima, H.
|
|
2016
|
65 |
C |
p. 79-88
10 p.
|
artikel
|
| 2 |
An affordable experimental technique for SRAM write margin characterization for nanometer CMOS technologies
|
Alorda, Bartomeu
|
|
2016
|
65 |
C |
p. 280-288
9 p.
|
artikel
|
| 3 |
A Wiener process model for accelerated degradation analysis considering measurement errors
|
Li, Junxing
|
|
2016
|
65 |
C |
p. 8-15
8 p.
|
artikel
|
| 4 |
Ball-grid-array solder joint model for assembly-level impact reliability prediction
|
Kok, Chee Kuang
|
|
2016
|
65 |
C |
p. 184-191
8 p.
|
artikel
|
| 5 |
Characterization on acceleration-factor equation for packaging-solder joint reliability
|
Wu, K.-C.
|
|
2016
|
65 |
C |
p. 167-172
6 p.
|
artikel
|
| 6 |
Charge trapping related channel modulation instability in P-GaN gate HEMTs
|
Li, Xueyang
|
|
2016
|
65 |
C |
p. 35-40
6 p.
|
artikel
|
| 7 |
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm
|
Fan, Mengying
|
|
2016
|
65 |
C |
p. 192-197
6 p.
|
artikel
|
| 8 |
Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride
|
Bu, Fan
|
|
2016
|
65 |
C |
p. 225-233
9 p.
|
artikel
|
| 9 |
Development of a lifetime prediction model for lithium thionyl chloride batteries based on an accelerated degradation test
|
Cheng, Sijie
|
|
2016
|
65 |
C |
p. 274-279
6 p.
|
artikel
|
| 10 |
3D Flash Memories
|
Gan, Chong Leong
|
|
2016
|
65 |
C |
p. 327-328
2 p.
|
artikel
|
| 11 |
Economical design of H-bridge multilevel inverter drive controlled by modified fast algorithm
|
Mohammed, Jamal Abdul-Kareem
|
|
2016
|
65 |
C |
p. 89-97
9 p.
|
artikel
|
| 12 |
Editorial Board
|
|
|
2016
|
65 |
C |
p. IFC-
1 p.
|
artikel
|
| 13 |
Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
|
Ramli, M.I.I.
|
|
2016
|
65 |
C |
p. 255-264
10 p.
|
artikel
|
| 14 |
Electrical conduction mechanisms in the temperature-dependent current-voltage characteristics of poly(3-hexylthiophene)/n-type Si devices
|
Lin, Hong-Zhi
|
|
2016
|
65 |
C |
p. 60-63
4 p.
|
artikel
|
| 15 |
Electromechanical reliability of a flexible metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing
|
Yang, Sang Min
|
|
2016
|
65 |
C |
p. 151-159
9 p.
|
artikel
|
| 16 |
Experimental study of bias dependence of pulsed laser-induced single-event transient in SiGe HBT
|
Sun, Yabin
|
|
2016
|
65 |
C |
p. 41-46
6 p.
|
artikel
|
| 17 |
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
|
Le, Van Nhat
|
|
2016
|
65 |
C |
p. 243-254
12 p.
|
artikel
|
| 18 |
Influence of local thermal dissipation on electromigration in an Al thin-film line
|
Li, Yuan
|
|
2016
|
65 |
C |
p. 178-183
6 p.
|
artikel
|
| 19 |
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process
|
Ishak, M.H.H.
|
|
2016
|
65 |
C |
p. 205-216
12 p.
|
artikel
|
| 20 |
Lifetime estimation for IGBT modules in wind turbine power converter system considering ambient temperature
|
Du, Xiong
|
|
2016
|
65 |
C |
p. 69-78
10 p.
|
artikel
|
| 21 |
Lithium-ion batteries remaining useful life prediction based on a mixture of empirical mode decomposition and ARIMA model
|
Zhou, Yapeng
|
|
2016
|
65 |
C |
p. 265-273
9 p.
|
artikel
|
| 22 |
Mechanisms and solutions to the brittle solder joint in electroless Ni plating
|
Wang, Xuan
|
|
2016
|
65 |
C |
p. 173-177
5 p.
|
artikel
|
| 23 |
Microwave effects of UV light exposure of a GaN HEMT: Measurements and model extraction
|
Caddemi, Alina
|
|
2016
|
65 |
C |
p. 310-317
8 p.
|
artikel
|
| 24 |
Moisture diffusion modeling – A critical review
|
Wong, E.H.
|
|
2016
|
65 |
C |
p. 318-326
9 p.
|
artikel
|
| 25 |
Nb-doped Ga2O3 as charge-trapping layer for nonvolatile memory applications
|
Shi, R.P.
|
|
2016
|
65 |
C |
p. 64-68
5 p.
|
artikel
|
| 26 |
Off-state degradation with ac bias in PMOSFET
|
Park, Segeun
|
|
2016
|
65 |
C |
p. 16-19
4 p.
|
artikel
|
| 27 |
Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate
|
Wu, Peng
|
|
2016
|
65 |
C |
p. 98-107
10 p.
|
artikel
|
| 28 |
Phase displacement study in MOSFET based ring VCOs due to heavy-ion irradiation using 3D-TCAD and circuit simulation
|
Ponnambalam, Maran
|
|
2016
|
65 |
C |
p. 27-34
8 p.
|
artikel
|
| 29 |
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs
|
Kim, Yeonsung
|
|
2016
|
65 |
C |
p. 234-242
9 p.
|
artikel
|
| 30 |
Read static noise margin aging model considering SBD and BTI effects for FinFET SRAMs
|
Mehrabi, Kolsoom
|
|
2016
|
65 |
C |
p. 20-26
7 p.
|
artikel
|
| 31 |
Reliable data transfer Rendezvous protocol in wireless sensor networks using 2D-SEC-DED encoding technique
|
Nikolic, Goran S.
|
|
2016
|
65 |
C |
p. 289-309
21 p.
|
artikel
|
| 32 |
RF measurements to pinpoint defects in inkjet-printed, thermally and mechanically stressed coplanar waveguides
|
Myllymäki, Sami
|
|
2016
|
65 |
C |
p. 142-150
9 p.
|
artikel
|
| 33 |
RoHS compliance in safety and reliability critical electronics
|
George, Elviz
|
|
2016
|
65 |
C |
p. 1-7
7 p.
|
artikel
|
| 34 |
Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid
|
Fennell, Brett
|
|
2016
|
65 |
C |
p. 217-224
8 p.
|
artikel
|
| 35 |
Study of process induced variability of germanium-pTFET in analog and RF domain
|
Ghosh, Sayani
|
|
2016
|
65 |
C |
p. 47-54
8 p.
|
artikel
|
| 36 |
The fast neutron irradiation influence on the AlGaAs IR-LEDs reliability
|
Gradoboev, A.V.
|
|
2016
|
65 |
C |
p. 55-59
5 p.
|
artikel
|
| 37 |
Thermo-mechanical simulation of PCB with embedded components
|
Kpobie, W.
|
|
2016
|
65 |
C |
p. 108-130
23 p.
|
artikel
|
| 38 |
The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process
|
Lin, Lin
|
|
2016
|
65 |
C |
p. 198-204
7 p.
|
artikel
|
| 39 |
Thickness-dependent non-Fickian moisture absorption in epoxy molding compounds
|
Wong, K.J.
|
|
2016
|
65 |
C |
p. 160-166
7 p.
|
artikel
|
| 40 |
Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging
|
Huang, De-Shau
|
|
2016
|
65 |
C |
p. 131-141
11 p.
|
artikel
|
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