| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Adaptive reliability satisfaction in wireless sensor networks through controlling the number of active routing paths
|
Alirezaeyan, Javad
|
|
2015
|
55 |
11 |
p. 2412-2422
11 p.
|
artikel
|
| 2 |
Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations
|
Schöngrundner, R.
|
|
2015
|
55 |
11 |
p. 2382-2390
9 p.
|
artikel
|
| 3 |
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module
|
Rajaguru, Pushparajah
|
|
2015
|
55 |
11 |
p. 2371-2381
11 p.
|
artikel
|
| 4 |
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption
|
Wong, E.H.
|
|
2015
|
55 |
11 |
p. 2331-2335
5 p.
|
artikel
|
| 5 |
Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints
|
Ding, Ying
|
|
2015
|
55 |
11 |
p. 2396-2402
7 p.
|
artikel
|
| 6 |
Crossbar array of selector-less TaO x /TiO2 bilayer RRAM
|
Chou, Chun-Tse
|
|
2015
|
55 |
11 |
p. 2220-2223
4 p.
|
artikel
|
| 7 |
Cross-layer custom instruction selection to address PVTA variations and soft error
|
Farahani, Bahar
|
|
2015
|
55 |
11 |
p. 2423-2438
16 p.
|
artikel
|
| 8 |
Cu–Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing
|
Tan, Y.Y.
|
|
2015
|
55 |
11 |
p. 2316-2323
8 p.
|
artikel
|
| 9 |
Design and characterization of ESD solutions with EMC robustness for automotive applications
|
Xi, Yunfeng
|
|
2015
|
55 |
11 |
p. 2236-2246
11 p.
|
artikel
|
| 10 |
Design optimization of RF-MEMS switch considering thermally induced residual stress and process uncertainties
|
Saleem, Muhammad Mubasher
|
|
2015
|
55 |
11 |
p. 2284-2298
15 p.
|
artikel
|
| 11 |
Design space exploration of non-uniform cache access for soft-error vulnerability mitigation
|
Maghsoudloo, Mohammad
|
|
2015
|
55 |
11 |
p. 2439-2452
14 p.
|
artikel
|
| 12 |
Editorial
|
Liou, Juin J.
|
|
2015
|
55 |
11 |
p. 2173-
1 p.
|
artikel
|
| 13 |
Editorial Board
|
|
|
2015
|
55 |
11 |
p. IFC-
1 p.
|
artikel
|
| 14 |
Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading
|
Zhang, H.W.
|
|
2015
|
55 |
11 |
p. 2391-2395
5 p.
|
artikel
|
| 15 |
Fabrication of TiO2 compact layer precursor at various reaction times for dye sensitized solar cells
|
Chou, Hsueh-Tao
|
|
2015
|
55 |
11 |
p. 2208-2212
5 p.
|
artikel
|
| 16 |
Gate leakage current suppression and reliability improvement for ultra-low EOT Ge MOS devices by suitable HfAlO/HfON thickness and sintering temperature
|
Chi, Wei-Fong
|
|
2015
|
55 |
11 |
p. 2183-2187
5 p.
|
artikel
|
| 17 |
20GHz on-chip measurement of ESD waveform for system level analysis
|
Caignet, F.
|
|
2015
|
55 |
11 |
p. 2276-2283
8 p.
|
artikel
|
| 18 |
Heat stress exposing performance of deep-nano HK/MG nMOSFETs using DPN or PDA treatment
|
Wang, Shea-Jue
|
|
2015
|
55 |
11 |
p. 2203-2207
5 p.
|
artikel
|
| 19 |
Identification of an RF degradation mechanism in GaN based HEMTs triggered by midgap traps
|
Sasikumar, A.
|
|
2015
|
55 |
11 |
p. 2258-2262
5 p.
|
artikel
|
| 20 |
Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints
|
Tegehall, Per-Erik
|
|
2015
|
55 |
11 |
p. 2354-2370
17 p.
|
artikel
|
| 21 |
Improved reliability of large-sized a-Si thin-film-transistor by back channel treatment in H2
|
Lee, Hao-Chieh
|
|
2015
|
55 |
11 |
p. 2178-2182
5 p.
|
artikel
|
| 22 |
Improving retention properties by thermal imidization for polyimide-based nonvolatile resistive random access memories
|
Hsiao, Yu-Ping
|
|
2015
|
55 |
11 |
p. 2188-2197
10 p.
|
artikel
|
| 23 |
Increasing the cycle life of lithium ion cells by partial state of charge cycling
|
de Vries, Hans
|
|
2015
|
55 |
11 |
p. 2247-2253
7 p.
|
artikel
|
| 24 |
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology
|
Lee, Chang-Chun
|
|
2015
|
55 |
11 |
p. 2213-2219
7 p.
|
artikel
|
| 25 |
In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens
|
Mertens, James C.E.
|
|
2015
|
55 |
11 |
p. 2345-2353
9 p.
|
artikel
|
| 26 |
Investigation on SCR-based ESD protection device for biomedical integrated circuits in a 0.18-μm CMOS process
|
Lin, Chun-Yu
|
|
2015
|
55 |
11 |
p. 2229-2235
7 p.
|
artikel
|
| 27 |
Leakage current mechanism and effect of Y2O3 doped with Zr high-K gate dielectrics
|
Lin, K.C.
|
|
2015
|
55 |
11 |
p. 2198-2202
5 p.
|
artikel
|
| 28 |
Microstructural evaluation and failure analysis of Ag wire bonded to Al pads
|
Choi, Mi-Ri
|
|
2015
|
55 |
11 |
p. 2306-2315
10 p.
|
artikel
|
| 29 |
Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints
|
Yang, Guoshuai
|
|
2015
|
55 |
11 |
p. 2403-2411
9 p.
|
artikel
|
| 30 |
[No title]
|
Gan, Chong Leong
|
|
2015
|
55 |
11 |
p. 2481-
1 p.
|
artikel
|
| 31 |
On endurance and performance of erasure codes in SSD-based storage systems
|
Alinezhad Chamazcoti, Saeideh
|
|
2015
|
55 |
11 |
p. 2453-2467
15 p.
|
artikel
|
| 32 |
Probabilistic analysis of dynamic and temporal fault trees using accurate stochastic logic gates
|
Cheshmikhani, Elham
|
|
2015
|
55 |
11 |
p. 2468-2480
13 p.
|
artikel
|
| 33 |
Process optimization of RTA on the characteristics of ITO-coated GaN-based LEDs
|
Hao, H.L.
|
|
2015
|
55 |
11 |
p. 2263-2268
6 p.
|
artikel
|
| 34 |
Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications
|
Sridhar, Ashok
|
|
2015
|
55 |
11 |
p. 2324-2330
7 p.
|
artikel
|
| 35 |
Research on lumen depreciation related to LED packages by in-situ measurement method
|
Quan, Chen
|
|
2015
|
55 |
11 |
p. 2269-2275
7 p.
|
artikel
|
| 36 |
Study of radiation hardness of HfO2-based resistive switching memory at nanoscale by conductive atomic force microscopy
|
Lin, Shih-Hung
|
|
2015
|
55 |
11 |
p. 2224-2228
5 p.
|
artikel
|
| 37 |
The effect of various concentrations of PVDF-HFP polymer gel electrolyte for dye-sensitized solar cell
|
Chou, Hsueh-Tao
|
|
2015
|
55 |
11 |
p. 2174-2177
4 p.
|
artikel
|
| 38 |
Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics
|
Chiu, Tz-Cheng
|
|
2015
|
55 |
11 |
p. 2336-2344
9 p.
|
artikel
|
| 39 |
Ultra sensitive measurement of dielectric current under pulsed stress conditions
|
Helfmeier, Clemens
|
|
2015
|
55 |
11 |
p. 2254-2257
4 p.
|
artikel
|
| 40 |
Zinc oxide-praseodymia semiconducting varistors having a powerful surge suppression capability
|
Nahm, Choon-W.
|
|
2015
|
55 |
11 |
p. 2299-2305
7 p.
|
artikel
|
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