no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
Adaptive reliability satisfaction in wireless sensor networks through controlling the number of active routing paths
|
Alirezaeyan, Javad |
|
2015 |
55 |
11 |
p. 2412-2422 11 p. |
article |
2 |
Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations
|
Schöngrundner, R. |
|
2015 |
55 |
11 |
p. 2382-2390 9 p. |
article |
3 |
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module
|
Rajaguru, Pushparajah |
|
2015 |
55 |
11 |
p. 2371-2381 11 p. |
article |
4 |
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption
|
Wong, E.H. |
|
2015 |
55 |
11 |
p. 2331-2335 5 p. |
article |
5 |
Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints
|
Ding, Ying |
|
2015 |
55 |
11 |
p. 2396-2402 7 p. |
article |
6 |
Crossbar array of selector-less TaO x /TiO2 bilayer RRAM
|
Chou, Chun-Tse |
|
2015 |
55 |
11 |
p. 2220-2223 4 p. |
article |
7 |
Cross-layer custom instruction selection to address PVTA variations and soft error
|
Farahani, Bahar |
|
2015 |
55 |
11 |
p. 2423-2438 16 p. |
article |
8 |
Cu–Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing
|
Tan, Y.Y. |
|
2015 |
55 |
11 |
p. 2316-2323 8 p. |
article |
9 |
Design and characterization of ESD solutions with EMC robustness for automotive applications
|
Xi, Yunfeng |
|
2015 |
55 |
11 |
p. 2236-2246 11 p. |
article |
10 |
Design optimization of RF-MEMS switch considering thermally induced residual stress and process uncertainties
|
Saleem, Muhammad Mubasher |
|
2015 |
55 |
11 |
p. 2284-2298 15 p. |
article |
11 |
Design space exploration of non-uniform cache access for soft-error vulnerability mitigation
|
Maghsoudloo, Mohammad |
|
2015 |
55 |
11 |
p. 2439-2452 14 p. |
article |
12 |
Editorial
|
Liou, Juin J. |
|
2015 |
55 |
11 |
p. 2173- 1 p. |
article |
13 |
Editorial Board
|
|
|
2015 |
55 |
11 |
p. IFC- 1 p. |
article |
14 |
Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading
|
Zhang, H.W. |
|
2015 |
55 |
11 |
p. 2391-2395 5 p. |
article |
15 |
Fabrication of TiO2 compact layer precursor at various reaction times for dye sensitized solar cells
|
Chou, Hsueh-Tao |
|
2015 |
55 |
11 |
p. 2208-2212 5 p. |
article |
16 |
Gate leakage current suppression and reliability improvement for ultra-low EOT Ge MOS devices by suitable HfAlO/HfON thickness and sintering temperature
|
Chi, Wei-Fong |
|
2015 |
55 |
11 |
p. 2183-2187 5 p. |
article |
17 |
20GHz on-chip measurement of ESD waveform for system level analysis
|
Caignet, F. |
|
2015 |
55 |
11 |
p. 2276-2283 8 p. |
article |
18 |
Heat stress exposing performance of deep-nano HK/MG nMOSFETs using DPN or PDA treatment
|
Wang, Shea-Jue |
|
2015 |
55 |
11 |
p. 2203-2207 5 p. |
article |
19 |
Identification of an RF degradation mechanism in GaN based HEMTs triggered by midgap traps
|
Sasikumar, A. |
|
2015 |
55 |
11 |
p. 2258-2262 5 p. |
article |
20 |
Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints
|
Tegehall, Per-Erik |
|
2015 |
55 |
11 |
p. 2354-2370 17 p. |
article |
21 |
Improved reliability of large-sized a-Si thin-film-transistor by back channel treatment in H2
|
Lee, Hao-Chieh |
|
2015 |
55 |
11 |
p. 2178-2182 5 p. |
article |
22 |
Improving retention properties by thermal imidization for polyimide-based nonvolatile resistive random access memories
|
Hsiao, Yu-Ping |
|
2015 |
55 |
11 |
p. 2188-2197 10 p. |
article |
23 |
Increasing the cycle life of lithium ion cells by partial state of charge cycling
|
de Vries, Hans |
|
2015 |
55 |
11 |
p. 2247-2253 7 p. |
article |
24 |
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology
|
Lee, Chang-Chun |
|
2015 |
55 |
11 |
p. 2213-2219 7 p. |
article |
25 |
In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens
|
Mertens, James C.E. |
|
2015 |
55 |
11 |
p. 2345-2353 9 p. |
article |
26 |
Investigation on SCR-based ESD protection device for biomedical integrated circuits in a 0.18-μm CMOS process
|
Lin, Chun-Yu |
|
2015 |
55 |
11 |
p. 2229-2235 7 p. |
article |
27 |
Leakage current mechanism and effect of Y2O3 doped with Zr high-K gate dielectrics
|
Lin, K.C. |
|
2015 |
55 |
11 |
p. 2198-2202 5 p. |
article |
28 |
Microstructural evaluation and failure analysis of Ag wire bonded to Al pads
|
Choi, Mi-Ri |
|
2015 |
55 |
11 |
p. 2306-2315 10 p. |
article |
29 |
Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints
|
Yang, Guoshuai |
|
2015 |
55 |
11 |
p. 2403-2411 9 p. |
article |
30 |
[No title]
|
Gan, Chong Leong |
|
2015 |
55 |
11 |
p. 2481- 1 p. |
article |
31 |
On endurance and performance of erasure codes in SSD-based storage systems
|
Alinezhad Chamazcoti, Saeideh |
|
2015 |
55 |
11 |
p. 2453-2467 15 p. |
article |
32 |
Probabilistic analysis of dynamic and temporal fault trees using accurate stochastic logic gates
|
Cheshmikhani, Elham |
|
2015 |
55 |
11 |
p. 2468-2480 13 p. |
article |
33 |
Process optimization of RTA on the characteristics of ITO-coated GaN-based LEDs
|
Hao, H.L. |
|
2015 |
55 |
11 |
p. 2263-2268 6 p. |
article |
34 |
Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications
|
Sridhar, Ashok |
|
2015 |
55 |
11 |
p. 2324-2330 7 p. |
article |
35 |
Research on lumen depreciation related to LED packages by in-situ measurement method
|
Quan, Chen |
|
2015 |
55 |
11 |
p. 2269-2275 7 p. |
article |
36 |
Study of radiation hardness of HfO2-based resistive switching memory at nanoscale by conductive atomic force microscopy
|
Lin, Shih-Hung |
|
2015 |
55 |
11 |
p. 2224-2228 5 p. |
article |
37 |
The effect of various concentrations of PVDF-HFP polymer gel electrolyte for dye-sensitized solar cell
|
Chou, Hsueh-Tao |
|
2015 |
55 |
11 |
p. 2174-2177 4 p. |
article |
38 |
Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics
|
Chiu, Tz-Cheng |
|
2015 |
55 |
11 |
p. 2336-2344 9 p. |
article |
39 |
Ultra sensitive measurement of dielectric current under pulsed stress conditions
|
Helfmeier, Clemens |
|
2015 |
55 |
11 |
p. 2254-2257 4 p. |
article |
40 |
Zinc oxide-praseodymia semiconducting varistors having a powerful surge suppression capability
|
Nahm, Choon-W. |
|
2015 |
55 |
11 |
p. 2299-2305 7 p. |
article |