nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A hierarchical defect repair approach for hybrid nano/CMOS memory reliability enhancement
|
Habibi, Mehdi |
|
2014 |
54 |
2 |
p. 475-484 |
artikel |
2 |
Editorial
|
Ersland, Peter |
|
2014 |
54 |
2 |
p. 341 |
artikel |
3 |
Effects of latent damage of recrystallization on lead free solder joints
|
Mayyas, Ahmad |
|
2014 |
54 |
2 |
p. 447-456 |
artikel |
4 |
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions
|
Yoon, Jeong-Won |
|
2014 |
54 |
2 |
p. 410-416 |
artikel |
5 |
Estimating activation energies for multi-mode failures
|
Nappa, Dario |
|
2014 |
54 |
2 |
p. 349-353 |
artikel |
6 |
High temperature bias-stress-induced instability in power trench-gated MOSFETs
|
Hao, J. |
|
2014 |
54 |
2 |
p. 374-380 |
artikel |
7 |
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints
|
Yang, Chaoran |
|
2014 |
54 |
2 |
p. 435-446 |
artikel |
8 |
Improved performance by using TaON/SiO2 as dual tunnel layer in Charge-Trapping nonvolatile memory
|
Chen, J.X. |
|
2014 |
54 |
2 |
p. 393-396 |
artikel |
9 |
Influence of rapid thermal annealing temperature on structure and electrical properties of high permittivity HfTiO thin film used in MOSFET
|
Ye, Cong |
|
2014 |
54 |
2 |
p. 388-392 |
artikel |
10 |
Inside front cover - Editorial board
|
|
|
2014 |
54 |
2 |
p. IFC |
artikel |
11 |
Lifetime prediction of thick aluminium wire bonds for mechanical cyclic loads
|
Merkle, L. |
|
2014 |
54 |
2 |
p. 417-424 |
artikel |
12 |
Methodology for predicting off-state reliability in GaN power transistors
|
Whitman, Charles S. |
|
2014 |
54 |
2 |
p. 354-359 |
artikel |
13 |
Modelling the self-alignment of passive chip components during reflow soldering
|
Krammer, Olivér |
|
2014 |
54 |
2 |
p. 457-463 |
artikel |
14 |
Monte Carlo Static Timing Analysis with statistical sampling
|
Merrett, Michael |
|
2014 |
54 |
2 |
p. 464-474 |
artikel |
15 |
[No title]
|
Gan, Chong Leong |
|
2014 |
54 |
2 |
p. 490 |
artikel |
16 |
Parametric defect localization on integrated circuits – From static laser stimulation to real-time variation mapping (RTVM)
|
Saury, L. |
|
2014 |
54 |
2 |
p. 366-373 |
artikel |
17 |
Process reliability screening in situ
|
Marchut, Leslie |
|
2014 |
54 |
2 |
p. 342-348 |
artikel |
18 |
Quantum coupling effects on charging dynamics of nanocrystalline memory devices
|
Mao, Ling-Feng |
|
2014 |
54 |
2 |
p. 404-409 |
artikel |
19 |
Reliability assessment of CMOS differential cross-coupled LC oscillators and a novel on chip self-healing approach against aging phenomena
|
Afacan, Engin |
|
2014 |
54 |
2 |
p. 397-403 |
artikel |
20 |
Reliability of the doping concentration in an ultra-thin body and buried oxide silicon on insulator (SOI) and comparison with a partially depleted SOI
|
Chang, Wen-Teng |
|
2014 |
54 |
2 |
p. 485-489 |
artikel |
21 |
Separating HBT wearout from defects during early life operation
|
Roesch, William J. |
|
2014 |
54 |
2 |
p. 360-365 |
artikel |
22 |
The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer
|
Ma, He |
|
2014 |
54 |
2 |
p. 425-434 |
artikel |
23 |
Time-dependent-dielectric-breakdown characteristics of Hf-doped Ta2O5/SiO2 stack
|
Atanassova, E. |
|
2014 |
54 |
2 |
p. 381-387 |
artikel |