| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A hierarchical defect repair approach for hybrid nano/CMOS memory reliability enhancement
|
Habibi, Mehdi
|
|
2014
|
54 |
2 |
p. 475-484
|
article
|
| 2 |
Editorial
|
Ersland, Peter
|
|
2014
|
54 |
2 |
p. 341
|
article
|
| 3 |
Effects of latent damage of recrystallization on lead free solder joints
|
Mayyas, Ahmad
|
|
2014
|
54 |
2 |
p. 447-456
|
article
|
| 4 |
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions
|
Yoon, Jeong-Won
|
|
2014
|
54 |
2 |
p. 410-416
|
article
|
| 5 |
Estimating activation energies for multi-mode failures
|
Nappa, Dario
|
|
2014
|
54 |
2 |
p. 349-353
|
article
|
| 6 |
High temperature bias-stress-induced instability in power trench-gated MOSFETs
|
Hao, J.
|
|
2014
|
54 |
2 |
p. 374-380
|
article
|
| 7 |
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints
|
Yang, Chaoran
|
|
2014
|
54 |
2 |
p. 435-446
|
article
|
| 8 |
Improved performance by using TaON/SiO2 as dual tunnel layer in Charge-Trapping nonvolatile memory
|
Chen, J.X.
|
|
2014
|
54 |
2 |
p. 393-396
|
article
|
| 9 |
Influence of rapid thermal annealing temperature on structure and electrical properties of high permittivity HfTiO thin film used in MOSFET
|
Ye, Cong
|
|
2014
|
54 |
2 |
p. 388-392
|
article
|
| 10 |
Inside front cover - Editorial board
|
|
|
2014
|
54 |
2 |
p. IFC
|
article
|
| 11 |
Lifetime prediction of thick aluminium wire bonds for mechanical cyclic loads
|
Merkle, L.
|
|
2014
|
54 |
2 |
p. 417-424
|
article
|
| 12 |
Methodology for predicting off-state reliability in GaN power transistors
|
Whitman, Charles S.
|
|
2014
|
54 |
2 |
p. 354-359
|
article
|
| 13 |
Modelling the self-alignment of passive chip components during reflow soldering
|
Krammer, Olivér
|
|
2014
|
54 |
2 |
p. 457-463
|
article
|
| 14 |
Monte Carlo Static Timing Analysis with statistical sampling
|
Merrett, Michael
|
|
2014
|
54 |
2 |
p. 464-474
|
article
|
| 15 |
[No title]
|
Gan, Chong Leong
|
|
2014
|
54 |
2 |
p. 490
|
article
|
| 16 |
Parametric defect localization on integrated circuits – From static laser stimulation to real-time variation mapping (RTVM)
|
Saury, L.
|
|
2014
|
54 |
2 |
p. 366-373
|
article
|
| 17 |
Process reliability screening in situ
|
Marchut, Leslie
|
|
2014
|
54 |
2 |
p. 342-348
|
article
|
| 18 |
Quantum coupling effects on charging dynamics of nanocrystalline memory devices
|
Mao, Ling-Feng
|
|
2014
|
54 |
2 |
p. 404-409
|
article
|
| 19 |
Reliability assessment of CMOS differential cross-coupled LC oscillators and a novel on chip self-healing approach against aging phenomena
|
Afacan, Engin
|
|
2014
|
54 |
2 |
p. 397-403
|
article
|
| 20 |
Reliability of the doping concentration in an ultra-thin body and buried oxide silicon on insulator (SOI) and comparison with a partially depleted SOI
|
Chang, Wen-Teng
|
|
2014
|
54 |
2 |
p. 485-489
|
article
|
| 21 |
Separating HBT wearout from defects during early life operation
|
Roesch, William J.
|
|
2014
|
54 |
2 |
p. 360-365
|
article
|
| 22 |
The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer
|
Ma, He
|
|
2014
|
54 |
2 |
p. 425-434
|
article
|
| 23 |
Time-dependent-dielectric-breakdown characteristics of Hf-doped Ta2O5/SiO2 stack
|
Atanassova, E.
|
|
2014
|
54 |
2 |
p. 381-387
|
article
|
Journal description