nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Activation energy of drain-current degradation in GaN HEMTs under high-power DC stress
|
Wu, Yufei |
|
2014 |
54 |
12 |
p. 2668-2674 7 p. |
artikel |
2 |
Aging characteristics of ZnO–V2O5-based varistors for surge protection reliability
|
Nahm, Choon-W. |
|
2014 |
54 |
12 |
p. 2836-2842 7 p. |
artikel |
3 |
Analysis and resolution of a thermally accelerated early life failure mechanism in a 40V GaN FET
|
Gajewski, Donald A. |
|
2014 |
54 |
12 |
p. 2675-2681 7 p. |
artikel |
4 |
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages
|
Tsai, M.Y. |
|
2014 |
54 |
12 |
p. 2898-2904 7 p. |
artikel |
5 |
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
|
Yim, Byung-Seung |
|
2014 |
54 |
12 |
p. 2944-2950 7 p. |
artikel |
6 |
A review of HVI technology
|
Qiao, Ming |
|
2014 |
54 |
12 |
p. 2704-2716 13 p. |
artikel |
7 |
A yield improvement technique in severe process, voltage, and temperature variations and extreme voltage scaling
|
Radfar, Mohsen |
|
2014 |
54 |
12 |
p. 2813-2823 11 p. |
artikel |
8 |
Customized glass sealant for ceramic substrates for high temperature electronic application
|
Sharif, Ahmed |
|
2014 |
54 |
12 |
p. 2905-2910 6 p. |
artikel |
9 |
Decrease in on-state gate current of AlGaN/GaN HEMTs by recombination-enhanced defect reaction of generated hot carriers investigated by TCAD simulation
|
Sasaki, Hajime |
|
2014 |
54 |
12 |
p. 2662-2667 6 p. |
artikel |
10 |
Degradation transformation in spinel-type functional thick-film ceramic materials
|
Klym, H. |
|
2014 |
54 |
12 |
p. 2843-2848 6 p. |
artikel |
11 |
Design and analysis of noise margin, write ability and read stability of organic and hybrid 6-T SRAM cell
|
Kumar, Brijesh |
|
2014 |
54 |
12 |
p. 2801-2812 12 p. |
artikel |
12 |
Direct correlation between reliability and pH changes of phosphors for white light-emitting diodes
|
Choi, Minho |
|
2014 |
54 |
12 |
p. 2849-2852 4 p. |
artikel |
13 |
Editorial
|
Ersland, Peter |
|
2014 |
54 |
12 |
p. 2649- 1 p. |
artikel |
14 |
Effect of electron irradiation on morphological, compositional and electrical properties of nanocluster carbon thin films grown using room temperature based cathodic arc process for large area microelectronics
|
De, Shounak |
|
2014 |
54 |
12 |
p. 2740-2746 7 p. |
artikel |
15 |
Effects of PCBM concentration on the electrical properties of the Au/P3HT:PCBM/n-Si (MPS) Schottky barrier diodes
|
Tüzün Özmen, Özge |
|
2014 |
54 |
12 |
p. 2766-2774 9 p. |
artikel |
16 |
Failure analysis and improvement of 60V power UMOSFET
|
Wang, Debo |
|
2014 |
54 |
12 |
p. 2782-2787 6 p. |
artikel |
17 |
Fatigue life evaluation of wire bonds in LED packages using numerical analysis
|
Zhang, Sung-Uk |
|
2014 |
54 |
12 |
p. 2853-2859 7 p. |
artikel |
18 |
High-speed video analysis for kink formation in a bond wire looping
|
Han, Lei |
|
2014 |
54 |
12 |
p. 2935-2943 9 p. |
artikel |
19 |
Impact of bias conditions on performance degradation in SiGe HBTs irradiated by 10MeV Br ion
|
Sun, Yabin |
|
2014 |
54 |
12 |
p. 2728-2734 7 p. |
artikel |
20 |
Impact of gate metal work-function engineering for enhancement of subthreshold analog/RF performance of underlap dual material gate DG-FET
|
Kundu, Atanu |
|
2014 |
54 |
12 |
p. 2717-2722 6 p. |
artikel |
21 |
Implications of gate-edge electric field in AlGaN/GaN high electron mobility transistors during OFF-state degradation
|
Sun, H. |
|
2014 |
54 |
12 |
p. 2650-2655 6 p. |
artikel |
22 |
Implications of thermal instability on HBT power amplifier reliability
|
Chivukula, Venkata |
|
2014 |
54 |
12 |
p. 2688-2696 9 p. |
artikel |
23 |
Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts
|
Özkol, Emre |
|
2014 |
54 |
12 |
p. 2796-2800 5 p. |
artikel |
24 |
Influence of surface states on the voltage robustness of AlGaN/GaN HFET power devices
|
Wespel, M. |
|
2014 |
54 |
12 |
p. 2656-2661 6 p. |
artikel |
25 |
Influence of the surface roughness of the bottom electrode on the resistive-switching characteristics of Al/Al2O3/Al and Al/Al2O3/W structures fabricated on glass at 300°C
|
Molina, Joel |
|
2014 |
54 |
12 |
p. 2747-2753 7 p. |
artikel |
26 |
Inside front cover - Editorial board
|
|
|
2014 |
54 |
12 |
p. IFC- 1 p. |
artikel |
27 |
Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method
|
Cheng, Hsin-En |
|
2014 |
54 |
12 |
p. 2881-2897 17 p. |
artikel |
28 |
Investigation of high performance Edge Lifted Capacitors reliability for GaAs and GaN MMIC technology
|
Weng, Ming-Hung |
|
2014 |
54 |
12 |
p. 2697-2703 7 p. |
artikel |
29 |
Junction temperature management of IGBT module in power electronic converters
|
Zhou, Luowei |
|
2014 |
54 |
12 |
p. 2788-2795 8 p. |
artikel |
30 |
Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature
|
Zhu, Yongxin |
|
2014 |
54 |
12 |
p. 2922-2928 7 p. |
artikel |
31 |
Low cycle fatigue performance of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints
|
Qin, H.B. |
|
2014 |
54 |
12 |
p. 2911-2921 11 p. |
artikel |
32 |
Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics
|
Vidor, F.F. |
|
2014 |
54 |
12 |
p. 2760-2765 6 p. |
artikel |
33 |
Markov process based reliability model for laser diodes in space radiation environment
|
Liu, Yun |
|
2014 |
54 |
12 |
p. 2735-2739 5 p. |
artikel |
34 |
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
|
van den Ende, D.A. |
|
2014 |
54 |
12 |
p. 2860-2870 11 p. |
artikel |
35 |
Mechanical and environmental durability of roll-to-roll printed silver nanoparticle film using a rapid laser annealing process for flexible electronics
|
Yang, Min |
|
2014 |
54 |
12 |
p. 2871-2880 10 p. |
artikel |
36 |
Methodology for accurate extrapolation of InGaP/GaAs HBT safe operating area (SOA) for variations in emitter area and ballast resistor size
|
Howell, Robert S. |
|
2014 |
54 |
12 |
p. 2682-2687 6 p. |
artikel |
37 |
Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance
|
Xu, Ling |
|
2014 |
54 |
12 |
p. 2824-2835 12 p. |
artikel |
38 |
Nanotribological properties of ALD-processed bilayer TiO2/ZnO films
|
Wang, Wun-Kai |
|
2014 |
54 |
12 |
p. 2754-2759 6 p. |
artikel |
39 |
Predicting conducting yarn failure in woven electronic textiles
|
de Vries, Hans |
|
2014 |
54 |
12 |
p. 2956-2960 5 p. |
artikel |
40 |
Reliability matrix solution to multiple mechanism prediction
|
Bernstein, Joseph B. |
|
2014 |
54 |
12 |
p. 2951-2955 5 p. |
artikel |
41 |
Simulation of flicker noise in gate-all-around Silicon Nanowire MOSFETs including interface traps
|
Anandan, P. |
|
2014 |
54 |
12 |
p. 2723-2727 5 p. |
artikel |
42 |
The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy
|
Silva, Bismarck Luiz |
|
2014 |
54 |
12 |
p. 2929-2934 6 p. |
artikel |
43 |
The transient analysis of latch-up in CMOS transmission gate induced by laser
|
Qiu, Weicheng |
|
2014 |
54 |
12 |
p. 2775-2781 7 p. |
artikel |