| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A study of the linearity between I on and log I off of modern MOS transistors and its application to stress engineering
|
Lau, W.S.
|
|
2008
|
48 |
4 |
p. 497-503
7 p.
|
artikel
|
| 2 |
A unification of interface-state generation and hole-injection for hot-carrier-injection stress in low and high-voltage NMOSFET
|
Dai, M.Z.
|
|
2008
|
48 |
4 |
p. 504-507
4 p.
|
artikel
|
| 3 |
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
|
Zhang, Xiaowu
|
|
2008
|
48 |
4 |
p. 602-610
9 p.
|
artikel
|
| 4 |
Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings
|
Lee, Young Woo
|
|
2008
|
48 |
4 |
p. 631-637
7 p.
|
artikel
|
| 5 |
Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components
|
Chen, Y.S.
|
|
2008
|
48 |
4 |
p. 638-644
7 p.
|
artikel
|
| 6 |
Degradation of n-channel a-Si:H/nc-Si:H bilayer thin-film transistors under DC electrical stress
|
Arpatzanis, N.
|
|
2008
|
48 |
4 |
p. 531-536
6 p.
|
artikel
|
| 7 |
Deposition of aerosol (“hygroscopic dust”) on electronics – Mechanism and risk
|
Tencer, Michal
|
|
2008
|
48 |
4 |
p. 584-593
10 p.
|
artikel
|
| 8 |
Effect of doping concentration on avalanche multiplication and excess noise factor in submicron APD
|
You, A.H.
|
|
2008
|
48 |
4 |
p. 547-554
8 p.
|
artikel
|
| 9 |
Effect of surface finish material on printed circuit board for electrochemical migration
|
Noh, Bo-In
|
|
2008
|
48 |
4 |
p. 652-656
5 p.
|
artikel
|
| 10 |
Effects of length scaling on electromigration in dual-damascene copper interconnects
|
Lin, M.H.
|
|
2008
|
48 |
4 |
p. 569-577
9 p.
|
artikel
|
| 11 |
Effects of the metal gate on the stress-induced traps in Ta2O5/SiO2 stacks
|
Atanassova, E.
|
|
2008
|
48 |
4 |
p. 514-525
12 p.
|
artikel
|
| 12 |
Effects of Ti content and wet-N2 anneal on Ge MOS capacitors with HfTiO gate dielectric
|
Li, C.X.
|
|
2008
|
48 |
4 |
p. 526-530
5 p.
|
artikel
|
| 13 |
Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs
|
Hwang, J.S.
|
|
2008
|
48 |
4 |
p. 645-651
7 p.
|
artikel
|
| 14 |
Investigation of hot carrier degradation in asymmetric nDeMOS transistors
|
Wang, Qingxue
|
|
2008
|
48 |
4 |
p. 508-513
6 p.
|
artikel
|
| 15 |
Leaky modes of optical waveguides with varied refractive index for microchip optical interconnect applications – Asymptotic solutions
|
Zhu, Jianxin
|
|
2008
|
48 |
4 |
p. 555-562
8 p.
|
artikel
|
| 16 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
4 |
p. 659-660
2 p.
|
artikel
|
| 17 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
4 |
p. 661-662
2 p.
|
artikel
|
| 18 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
4 |
p. 657-658
2 p.
|
artikel
|
| 19 |
Numerical and experimental analysis of EMI effects on circuits with MESFET devices
|
Tsai, Han-Chang
|
|
2008
|
48 |
4 |
p. 537-546
10 p.
|
artikel
|
| 20 |
Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects
|
Wu, ZhenYu
|
|
2008
|
48 |
4 |
p. 578-583
6 p.
|
artikel
|
| 21 |
The influence of solder volume and pad area on Sn–3.8Ag–0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging
|
Wong, C.K.
|
|
2008
|
48 |
4 |
p. 611-621
11 p.
|
artikel
|
| 22 |
Theoretical and numerical analysis of the effect of constant velocity on thermosonic bond strength
|
He, Jun
|
|
2008
|
48 |
4 |
p. 594-601
8 p.
|
artikel
|
| 23 |
Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies
|
Nousiainen, O.
|
|
2008
|
48 |
4 |
p. 622-630
9 p.
|
artikel
|
| 24 |
Thermal impedance measurements under non-equilibrium conditions. How to extend its validity
|
Masana, F.N.
|
|
2008
|
48 |
4 |
p. 563-568
6 p.
|
artikel
|
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