| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A dual burn-in policy for defect-tolerant memory products using the number of repairs as a quality indicator
|
Tong, Seung-Hoon
|
|
2008
|
48 |
3 |
p. 471-480
10 p.
|
artikel
|
| 2 |
A junction characterization for microelectronic devices quality and reliability
|
Tazibt, W.
|
|
2008
|
48 |
3 |
p. 348-353
6 p.
|
artikel
|
| 3 |
A new model of subthreshold swing for sub-100nm MOSFETs
|
Yang, Lin-An
|
|
2008
|
48 |
3 |
p. 342-347
6 p.
|
artikel
|
| 4 |
Assessment of temperature and voltage accelerating factors for 2.3–3.2nm SiO2 thin oxides stressed to hard breakdown
|
Pic, D.
|
|
2008
|
48 |
3 |
p. 335-341
7 p.
|
artikel
|
| 5 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
|
Yang, Ping-Feng
|
|
2008
|
48 |
3 |
p. 389-394
6 p.
|
artikel
|
| 6 |
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
|
Thijsse, J.
|
|
2008
|
48 |
3 |
p. 401-407
7 p.
|
artikel
|
| 7 |
Conduction mechanisms of silicon oxide/titanium oxide MOS stack structures
|
Tinoco, J.C.
|
|
2008
|
48 |
3 |
p. 370-381
12 p.
|
artikel
|
| 8 |
dc-Conduction mechanism in lanthanum–manganese oxide films grown on p-Si substrate
|
Dakhel, A.A.
|
|
2008
|
48 |
3 |
p. 395-400
6 p.
|
artikel
|
| 9 |
Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints
|
Shirley, Dwayne R.
|
|
2008
|
48 |
3 |
p. 455-470
16 p.
|
artikel
|
| 10 |
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints
|
Yu, Qiang
|
|
2008
|
48 |
3 |
p. 431-437
7 p.
|
artikel
|
| 11 |
Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging
|
Wan, J.W.
|
|
2008
|
48 |
3 |
p. 425-430
6 p.
|
artikel
|
| 12 |
Extraction of interface states at emitter–base heterojunctions in AlGaAs/GaAs heterostructure bipolar transistors using sub-bandgap photonic excitation
|
Kim, Se Woon
|
|
2008
|
48 |
3 |
p. 382-388
7 p.
|
artikel
|
| 13 |
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
|
Hang, C.J.
|
|
2008
|
48 |
3 |
p. 416-424
9 p.
|
artikel
|
| 14 |
Impact of single pMOSFET dielectric degradation on NAND circuit performance
|
Estrada, D.
|
|
2008
|
48 |
3 |
p. 354-363
10 p.
|
artikel
|
| 15 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
3 |
p. 494-495
2 p.
|
artikel
|
| 16 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
3 |
p. 490-491
2 p.
|
artikel
|
| 17 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
3 |
p. 492-493
2 p.
|
artikel
|
| 18 |
Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement
|
Jiang, Li
|
|
2008
|
48 |
3 |
p. 438-444
7 p.
|
artikel
|
| 19 |
Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers
|
Chen, K.M.
|
|
2008
|
48 |
3 |
p. 408-415
8 p.
|
artikel
|
| 20 |
Reliability functions estimated from commonly used yield models
|
Kim, Kyungmee O.
|
|
2008
|
48 |
3 |
p. 481-489
9 p.
|
artikel
|
| 21 |
Suppression of Ge–O and Ge–N bonding at Ge–HfO2 and Ge–TiO2 interfaces by deposition onto plasma-nitrided passivated Ge substrates: Integration issues Ge gate stacks into advanced devices
|
Lee, S.
|
|
2008
|
48 |
3 |
p. 364-369
6 p.
|
artikel
|
| 22 |
Thermal transient characteristics of die attach in high power LED PKG
|
Kim, Hyun-Ho
|
|
2008
|
48 |
3 |
p. 445-454
10 p.
|
artikel
|
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