| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A 2D threshold-voltage model for small MOSFET with quantum-mechanical effects
|
Xu, J.P.
|
|
2008
|
48 |
1 |
p. 23-28
6 p.
|
artikel
|
| 2 |
A new electrothermal average model of the diode–transistor switch
|
Górecki, Krzysztof
|
|
2008
|
48 |
1 |
p. 51-58
8 p.
|
artikel
|
| 3 |
A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boards
|
Weinberg, K.
|
|
2008
|
48 |
1 |
p. 68-82
15 p.
|
artikel
|
| 4 |
A study of nanoparticles in Sn–Ag based lead free solders
|
Amagai, Masazumi
|
|
2008
|
48 |
1 |
p. 1-16
16 p.
|
artikel
|
| 5 |
A threshold voltage model for short-channel MOSFETs taking into account the varying depth of channel depletion layers around the source and drain
|
Baishya, Srimanta
|
|
2008
|
48 |
1 |
p. 17-22
6 p.
|
artikel
|
| 6 |
Clock aligner based on delay locked loop with double edge synchronization
|
Stojčev, Mile
|
|
2008
|
48 |
1 |
p. 158-166
9 p.
|
artikel
|
| 7 |
Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effects
|
Heller, E.R.
|
|
2008
|
48 |
1 |
p. 45-50
6 p.
|
artikel
|
| 8 |
Experimental and statistical study in adhesion features of bonded interfaces of IC packages
|
Chien, Chi-Hui
|
|
2008
|
48 |
1 |
p. 140-148
9 p.
|
artikel
|
| 9 |
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
|
Nakadaira, Yoshikuni
|
|
2008
|
48 |
1 |
p. 83-104
22 p.
|
artikel
|
| 10 |
Investigation of relation between intermetallic and tin whisker growths under ambient condition
|
Kim, K.S.
|
|
2008
|
48 |
1 |
p. 111-118
8 p.
|
artikel
|
| 11 |
Methodology of semiconductor devices classification into groups of differentiated quality
|
Konczakowska, Alicja
|
|
2008
|
48 |
1 |
p. 37-44
8 p.
|
artikel
|
| 12 |
Modeling the sensitivity of CMOS circuits to radiation induced single event transients
|
Wirth, Gilson I.
|
|
2008
|
48 |
1 |
p. 29-36
8 p.
|
artikel
|
| 13 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
1 |
p. 169-170
2 p.
|
artikel
|
| 14 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
1 |
p. 171-172
2 p.
|
artikel
|
| 15 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
1 |
p. 167-168
2 p.
|
artikel
|
| 16 |
Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise
|
Ding, Yong
|
|
2008
|
48 |
1 |
p. 149-157
9 p.
|
artikel
|
| 17 |
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
|
Mao, Chao-Yang
|
|
2008
|
48 |
1 |
p. 119-131
13 p.
|
artikel
|
| 18 |
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions
|
Wang, Tong Hong
|
|
2008
|
48 |
1 |
p. 132-139
8 p.
|
artikel
|
| 19 |
Simultaneous mechanical and electrical straining of conventional thick-film resistors
|
Stanimirović, Z.
|
|
2008
|
48 |
1 |
p. 59-67
9 p.
|
artikel
|
| 20 |
Whisker growth on tin finishes of different electrolytes
|
Jiang, Bo
|
|
2008
|
48 |
1 |
p. 105-110
6 p.
|
artikel
|
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