no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
A 2D threshold-voltage model for small MOSFET with quantum-mechanical effects
|
Xu, J.P. |
|
2008 |
48 |
1 |
p. 23-28 6 p. |
article |
2 |
A new electrothermal average model of the diode–transistor switch
|
Górecki, Krzysztof |
|
2008 |
48 |
1 |
p. 51-58 8 p. |
article |
3 |
A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boards
|
Weinberg, K. |
|
2008 |
48 |
1 |
p. 68-82 15 p. |
article |
4 |
A study of nanoparticles in Sn–Ag based lead free solders
|
Amagai, Masazumi |
|
2008 |
48 |
1 |
p. 1-16 16 p. |
article |
5 |
A threshold voltage model for short-channel MOSFETs taking into account the varying depth of channel depletion layers around the source and drain
|
Baishya, Srimanta |
|
2008 |
48 |
1 |
p. 17-22 6 p. |
article |
6 |
Clock aligner based on delay locked loop with double edge synchronization
|
Stojčev, Mile |
|
2008 |
48 |
1 |
p. 158-166 9 p. |
article |
7 |
Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effects
|
Heller, E.R. |
|
2008 |
48 |
1 |
p. 45-50 6 p. |
article |
8 |
Experimental and statistical study in adhesion features of bonded interfaces of IC packages
|
Chien, Chi-Hui |
|
2008 |
48 |
1 |
p. 140-148 9 p. |
article |
9 |
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
|
Nakadaira, Yoshikuni |
|
2008 |
48 |
1 |
p. 83-104 22 p. |
article |
10 |
Investigation of relation between intermetallic and tin whisker growths under ambient condition
|
Kim, K.S. |
|
2008 |
48 |
1 |
p. 111-118 8 p. |
article |
11 |
Methodology of semiconductor devices classification into groups of differentiated quality
|
Konczakowska, Alicja |
|
2008 |
48 |
1 |
p. 37-44 8 p. |
article |
12 |
Modeling the sensitivity of CMOS circuits to radiation induced single event transients
|
Wirth, Gilson I. |
|
2008 |
48 |
1 |
p. 29-36 8 p. |
article |
13 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
1 |
p. 169-170 2 p. |
article |
14 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
1 |
p. 171-172 2 p. |
article |
15 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
1 |
p. 167-168 2 p. |
article |
16 |
Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise
|
Ding, Yong |
|
2008 |
48 |
1 |
p. 149-157 9 p. |
article |
17 |
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
|
Mao, Chao-Yang |
|
2008 |
48 |
1 |
p. 119-131 13 p. |
article |
18 |
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions
|
Wang, Tong Hong |
|
2008 |
48 |
1 |
p. 132-139 8 p. |
article |
19 |
Simultaneous mechanical and electrical straining of conventional thick-film resistors
|
Stanimirović, Z. |
|
2008 |
48 |
1 |
p. 59-67 9 p. |
article |
20 |
Whisker growth on tin finishes of different electrolytes
|
Jiang, Bo |
|
2008 |
48 |
1 |
p. 105-110 6 p. |
article |